Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SI2333
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SI2333
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SI2333
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0222269221
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.25W
- Gate Voltage(Vgs)
- 8V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 12V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SI2333 产品概述
产品名称: SI2333
类型: 场效应管 (MOSFET)
封装类型: SOT-23
品牌: BORN（伯恩半导体）
额定功率: 1.25W
最大漏极电压 (V_DS): 12V
最大漏极电流 (I_D): 7.1A
特性概述: SI2333是一款由伯恩半导体生产的高性能P沟道MOSFET，具有优良的电气特性和可靠的工作性能。该器件被广泛应用于各种电子电路中，如开关电源、马达驱动、负载控制和信号调节等。它在低电压和高电流下能够有效运行，适合多种工业和消费电子设备。
电气特性: SI2333的P沟道架构使其在关断时能够有效抑制反向电流，从而确保电路的安全性和稳定性。在1.25W的功率限制下，SI2333可承受最高12V的漏极电压，并能够实现7.1A的最大漏极电流。其脉冲开关特性和快速响应时间使其能够胜任高频率的开关操作，适合用于需要快速开关的应用场合。
关键参数:
- 导通电阻 (R_DS(on)): 低导通电阻是MOSFET的重要特性之一，SI2333的导通电阻在额定条件下表现优异，大幅度降低功耗和发热，提升整体电路的效率。
- 反向恢复特性: 优越的反向恢复特性使得SI2333在开关过程中生成的反向电流较小，可以有效减少由此带来的噪声和干扰。
应用场景:
- 电源管理: SI2333非常适合用于开关电源和DC-DC转换器，在电源管理中起到高效转换的作用。
- 马达控制: 在改革和控制直流马达的驱动系统中，SI2333确保了可靠的开关控制和负载调节。
- 负载开关: SI2333可用作负载开关，控制电路中的各种负载，包括LED照明、加热元件等。
- 信号开关: 它能够实现高频开关动作，适合用于音视频设备的信号切换以及其他信号处理场合。
优点:
- 高效率: 其低导通电阻和高电流处理能力确保了电路的高能效，减少了不必要的能量损耗。
- 小型封装: SOT-23封装使得SI2333适合于小型化设计，便于集成到各种紧凑型电子设备中。
- 可靠性高: 伯恩半导体凭借其高质量的制造工艺，确保SI2333在长期工作中具有稳定的性能表现和出色的使用寿命。
温度范围: SI2333的工作环境温度一般在-55°C到+150°C之间，这使得它能够适应不同的工作环境，包括高温和低温应用。
结论
SI2333作为一款功能强大的P沟道MOSFET，在小型化电子设备中提供了出色的电气性能和可靠性。无论是在电源管理、马达控制，还是在负载开关和信号开关应用中，SI2333都能够为设计师和工程师提供一个高效、经济和高性能的选择。通过合理利用其特性，用户可以在复杂的电气设计中实现更高的效率和更好的耐用性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
