WMSIC Electronic Components

BORN BSDFN2C031U

ModelBSDFN2C031U
PackageDFN1006
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSDFN2C031U
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSDFN2C031U
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.008g
Electronic Component
1
Cj- Capacitor
0.65pF
Electronic Component
BM0264602938
Voltage
6.2V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSDFN2C031U 产品概述

一、产品简介

BSDFN2C031U 是 BORN(伯恩半导体)推出的一款双向瞬态抑制二极管(TVS),采用超小型 DFN1006 封装,专为 3.3V 信号线和接口提供快速、低钳位能量吸收保护。器件响应快、钳位电压低,适合对信号完整性和功耗有严格要求的便携与工业应用。

二、主要性能参数

  • 极性:双向(Bidirectional)
  • 反向稳态电压 Vrwm:3.3V
  • 钳位电压 Vclamp:6.2V(典型)
  • 峰值脉冲电流 Ipp:7A @ 8/20µs
  • 峰值脉冲功率 Ppp:50W @ 8/20µs
  • 反向漏电流 Ir:500 nA(典型)
  • 结电容 Cj:0.65 pF(低电容,适合高速信号)
  • ESD 能力:接触放电 ±8 kV,空放电 ±15 kV
  • 防护等级与认证:符合 IEC 61000-4-2 / 4-4 / 4-5 标准
  • 封装:DFN1006(超小封装,便于贴片)

三、特性与优势

  • 低钳位:6.2V 钳位电压可在突发高压时有效保护下游 3.3V 器件,减少器件损伤风险。
  • 双向保护:对差分和双向信号线实现对称保护,无需区分极性,适合数据线与电源反向脉冲场景。
  • 超低结电容(0.65 pF):对高速接口(如串行总线、差分信号、时钟线)影响小,保持信号完整性。
  • 低漏电(500 nA):适合电池供电或低功耗设备,长期驻留不增加显著静态功耗。
  • 紧凑封装:DFN1006 占板面积小,便于空间受限的移动设备与模块化设计。

四、典型应用

  • USB、HDMI、MIPI、CSI 等高速数据接口保护
  • 手机、平板、摄像头等便携终端的信号口防护
  • IoT 终端、路由器、基站模块的外部接口保护
  • 工业控制与仪表的接口防雷击、浪涌与瞬态抑制
  • PCB 边缘连接器、板对板接口与传感器信号线保护

五、使用建议与布局注意事项

  • 元件应尽量靠近受保护的连接器或接口焊盘放置,最小化走线长度以降低串联电感。
  • 对高速差分信号,保持对称走线并尽量减少并联旁路元件对阻抗的影响。
  • 在高能量或频繁冲击应用中,检查焊盘与走线的热承载能力;必要时可在地平面处增加回流孔改善散热。
  • 双向器件无需关注极性,但仍需在电路中确认是否与其他单向防护器件冲突。

六、封装与认证信息

  • 封装型号:DFN1006,适合贴片自动化生产与回流焊工艺。
  • 品牌:BORN(伯恩半导体)
  • 符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)与 IEC 61000-4-5(浪涌)测试要求,满足多数工业与消费类电磁兼容防护规范。

总结:BSDFN2C031U 以其低钳位、低电容、低漏电和小封装的组合,成为 3.3V 信号接口与高速数据线保护的理想选择,尤其适用于对空间、功耗和信号完整性有严格要求的现代电子设备。

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