Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN ESD9L5.0ST5G-N
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN ESD9L5.0ST5G-N
- Type
- BORN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- ESD9L5.0ST5G-N
- Electronic Component
- 1
- Package
- DFN1006-2
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.6pF
- Electronic Component
- BM0211558765
- Voltage
- 13V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 500nA
- Voltage(VBR)
- 7.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESD9L5.0ST5G-N 产品概述
一、产品简介
ESD9L5.0ST5G-N 是由 BORN（伯恩半导体）生产的一款高性能静电放电（ESD）保护器件。其封装形式为0402（0.04x0.02英寸），是一种常见的小型表面贴装封装，适用于多种应用场景。这款器件主要用于保护敏感电子元件免受静电放电和其他瞬态电压事件的影响，能有效提高电子设备的耐用性和可靠性。
二、主要规格
电气特性：
- 工作电压：ESD9L5.0ST5G-N 的最大工作电压为5V，这使得它适合多种低压电子设备，如智能手机、平板电脑和其他消费类电子产品。
- 钳位电压：在ESD事件发生时，钳位电压会在特定的瞬态条件下达到最大值，通常这个值在设备的保护范围内，确保被保护线路的电压不至于过高。
- ESD等级：根据国际标准IEC 61000-4-2，ESD9L5.0ST5G-N 可承受高达15kV的接触放电和25kV的空气放电，这对于保护电子元件至关重要。
封装特性：
- 尺寸：0402 封装不仅小巧灵活，还能满足现代电子设备对空间的严格要求。该封装设计可以轻松集成到各种电路板上，适应高密度的排布需求。
- 材料：采用环保材料制造，符合RoHS标准，确保其在现代电子产品中的广泛应用和环境兼容性。
三、应用领域
ESD9L5.0ST5G-N 适用范围广泛，主要应用于以下领域：
消费电子：如智能手机、平板电脑、笔记本电脑及其附件（如充电器、耳机等）。确保这些设备在面对外部静电干扰时，其内部电路的安全。
工业设备：大多数工业控制系统和传感器也需面临静电放电的风险，使用本产品可提高设备的稳定性和寿命。
汽车电子：现代汽车中包含大量微电子元件，从发动机控制到车载娱乐系统，ESD9L5.0ST5G-N 在这些应用中提供了必要的保护。
通信设备：在各种网络设备和通信终端中，保护接口及信号线是必不可少的。本器件可以基础上提升数据传输的可靠性。
四、优势与特点
高可靠性：通过采用先进的制造工艺，ESD9L5.0ST5G-N 具有极低的失败率，能长时间保持稳定性能。
快速响应时间：该器件具有极快的响应时间，能够在微秒级别内对ESD事件做出反应，有效保护下游电路。
优秀的抑制能力：其良好的钳位电压特性保障了对敏感元件的优秀保护，防止因瞬态高压造成的设备故障。
小型化设计：0402 封装让产品在减少占板空间的同时，保持了优越的性能，符合现代电子产品对小型化的需求。
五、总结
ESD9L5.0ST5G-N 是一款性能优越、应用广泛的静电放电保护器件。凭借其高效的保护特性、小巧的0402封装与可靠的电气指标，它成为了当今电子行业中不可或缺的一部分。特别是在消费电子、工业设备、汽车电子及通信设备等领域，其表现均非常突出。因此，设计工程师在选用 ESD 保护器件时，ESD9L5.0ST5G-N 无疑是一个值得优先考虑的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
