WMSIC Electronic Components

BORN BDFN2C151V35

ModelBDFN2C151V35
PackageDFN1006-2
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BDFN2C151V35
Type
BORN
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BDFN2C151V35
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.006g
Electronic Component
1
Cj- Capacitor
25pF
Electronic Component
BM0229259071
Voltage
45V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
16.7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BDFN2C151V35 产品概述

一、产品简介

BDFN2C151V35 是 BORN(伯恩半导体)推出的一款双向 TVS(二极管)瞬态抑制器,封装为 DFN1006-2,针对线路级静电和浪涌冲击提供快速钳位保护。器件体积小、响应快、适用于对空间和电磁兼容性要求严格的消费与工业电子设备。

二、主要参数

  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:15 V(工作电压)
  • 击穿电压 Vbr:16.7 V(典型)
  • 钳位电压 Vcl:45 V(典型@Ipp 条件)
  • 峰值脉冲电流 Ipp:9 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:230 W @ 8/20 μs
  • 反向电流 Ir:500 nA(典型,@ Vrwm)
  • 结电容 Cj:25 pF(影响高速信号完整性)
  • 防护等级/符合标准:IEC 61000-4-2 (ESD)、IEC 61000-4-4 (EFT)、IEC 61000-4-5 (Surge)
  • 类型:ESD/浪涌保护器件
  • 封装:DFN1006-2(小外形、低电感)
  • 型号:BDFN2C151V35,品牌:BORN(伯恩半导体)

三、特点与优势

  • 双向结构,适合对称信号线或两端接地情形的保护(如数据对、交流信号线)。
  • 小封装(DFN1006-2),便于在受限空间内靠近被保护端口布局,降低寄生电感。
  • 良好的脉冲能量处理能力:9 A @ 8/20 μs,230 W 峰值功率,能承受常见的浪涌与放电事件。
  • 低反向漏流(500 nA),对待保护电路的静态性能影响小。
  • 结电容 25 pF,对中低速数据线可接受,需评估对高速接口(如 USB3.0 等)的影响。

四、典型应用

  • USB/串口/通讯接口、数据线防护(尤其工作电压 ≤15 V 的场合)。
  • 12 V 汽车电子接口、车载附件电源保护(注意评估汽车级要求和更高能量事件)。
  • 工业控制、仪表、消费类电子(充电口、信号输入端)等需对抗 ESD/EFT/Surge 的场景。
  • 接口附近作为一级保护器件,配合后级滤波/熔断器构成多级防护方案。

五、设计与布局建议

  • 器件应靠近受保护的连接器或传输线焊盘放置,最小化导线与走线回路面积以降低寄生电感和提升抑制效果。
  • 对地走线应使用低阻抗接地平面并在封装底部附近布设短而宽的接地过孔(vias),以提高热耗散能力与瞬态回流路径。
  • 对于高频或高速接口,结合结电容 25 pF 的影响,必要时在方案中采用差分匹配、阻抗控制或选用更低电容型号的 TVS。
  • 对于可能承受重复高能脉冲的场合,评估器件温升并考虑并联或级联更高能量的保护元件。

六、可靠性与合规性

BDFN2C151V35 符合 IEC 61000-4-2/4-4/4-5 等常见电磁兼容测试规范,能通过规范的静电放电、脉冲群与浪涌测试(具体等级以厂商数据表为准)。在实际应用中应参考制造商的寿命、储存和焊接工艺规范(如回流焊温度曲线、湿敏等级)以保证长期可靠性。

七、选型与注意事项

  • 确认系统最大工作电压 ≤15 V,以避免在正常工作时触发器件。
  • 若被保护信号对高带宽敏感,应评估 25 pF 结电容带来的延时与信号失真;必要时寻找低容抗型替代品。
  • 对于更严苛的浪涌能量或汽车级要求,建议参考更高能量等级或汽车认证的 TVS 器件。
  • 最终设计应基于厂商完整数据表与应用笔记进行验证测试(ESD、EFT、浪涌及热工况测试)。

如需封装尺寸图、回流焊建议、典型钳位曲线或 PCB 推荐拓扑,可提供更详细的参数表与参考设计。

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