WMSIC Electronic Components

BORN 2SK3019

Model2SK3019
PackageSOT-523
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 2SK3019
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
2SK3019
Electronic Component
1
Package
SOT-523
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0224315802
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
13pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK3019 产品概述

1. 产品基本信息

2SK3019 是一款高性能的 N 沟道场效应管(MOSFET),由伯恩半导体(BORN)生产,采用 SOT-523 封装,适用于各种低功耗电子设备。其关键参数包括:额定漏源电压为 30V,在 10mA 电流下表现出 8Ω 的导通电阻,以及 100mA 的最大漏电流。该 MOSFET 的设计使其在小型化、高效率及高可靠性的应用中尤为突出。

2. 产品特点

  • 高效能设计:2SK3019 的导通电阻在 4V 电压时为 8Ω,确保在正常工作条件下具有优良的电流传导能力,降低功耗和热管理压力,提升系统整体效率。

  • 宽电压范围:最高可承受 30V 的漏源电压,使其能够广泛应用于低至中等电压类别的电路,增强其适用性。

  • 小型化封装:SOT-523 封装不仅有助于节省空间,也是现代电子设备常用的封装形式之一。小型化的设计使其特别适用于对尺寸有严格要求的便携式设备。

  • 良好的开关特性:该 MOSFET 的开关速度快,适合用于高频率应用,如开关电源、DC-DC 转换器等,有助于提高设备的动态响应。

  • 高可靠性:作为一个优质半导体产品,2SK3019 的生产过程经过严格的质量控制,确保其在各种环境条件下具有稳定的性能,减少故障率。

3. 应用领域

2SK3019 可以广泛应用于以下几个领域:

  • 便携式电子设备:如智能手机、平板电脑和其他消费类电子产品,由于其低功耗和高效能,能够有效延长电池使用时间。

  • 电源管理:在开关电源、LED 驱动电源等场合,利用其快速开关特性,有效提高能量转换效率,减少能量损耗。

  • 汽车电子:在汽车中的各种控制模块,例如电驱动系统、传感器和信号处理等,该 MOSFET 的耐压能力和耐高温效果可以适应汽车环境。

  • 工业控制:在工厂自动化和智能化设备中,2SK3019 可用于电机驱动的控制,保证了运行的效率和稳定性。

  • 通信设备:在数据传输设备中,如路由器、交换机等,利用其小型化封装,能够有效实现设备内部信号的快速切换与传输。

4. 电气特性

了解 2SK3019 的一些基本电气特性,有助于设计人员更好地应用此款 MOSFET:

  • 漏源电压 (Vds):最大值为 30V,使其适应多种典型电子应用。

  • 最大漏电流 (Id):在 25°C 时可达到 100mA,适合多种工作环境之下。

  • 输入电容 (Ciss) 和反向恢复特性:低输入电容使其在开关状态下能够快速充放电,进一步提高开关效率。

  • 工作温度范围:该 MOSFET 支持 -55℃ 到 +150℃ 的广泛工作温度,增强了其在苛刻环境中的稳定性。

5. 结论

总之,2SK3019 N 沟道 MOSFET 是一款结合高效率、低功耗和小型化设计的优质电子元器件,凭借其可靠性和广泛的应用前景,为工程师们在电子设计中提供了更多的选择和便利。无论是在消费电子、工业控制还是汽车电子领域,2SK3019 都展现出了卓越的性能及适应性,是现代电子设备中不可或缺的基础元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.