WMSIC Electronic Components

BORN Rclamp0531T-N

ModelRclamp0531T-N
PackageDFN1006
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN Rclamp0531T-N
Type
BORN
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
Rclamp0531T-N
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0257674529
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Rclamp0531T-N 产品概述

一、产品简介

Rclamp0531T-N 是 BORN(伯恩半导体)推出的一款单路双向 ESD 保护器件,专为对低电压、高速信号线路的瞬态浪涌与静电放电(ESD)防护而设计。器件采用超小型 DFN1006 封装,具有低结电容、低漏电流和可靠的浪涌吸收能力,适用于便携设备、接口保护和精密信号链路的防护需求。

二、关键性能指标

  • 极性:双向(对正负极均能钳位)
  • 反向截止电压 Vrwm:5 V
  • 击穿电压 Vbr:6 V(典型)
  • 钳位电压 Vclamp:15 V(在峰值脉冲条件下)
  • 峰值脉冲电流 Ipp:3.5 A
  • 峰值脉冲功率 Ppp:60 W(8/20 μs 波形)
  • 反向电流 Ir:500 nA(在 Vrwm 下)
  • 结电容 Cj:0.5 pF(典型)
  • 通道数:单路
  • 防护等级与标准:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)
  • 封装:DFN1006(极小 1.0 × 0.6 mm 类封装)

三、主要特点

  • 极低结电容(0.5 pF):对高速信号影响极小,适合保护 USB2.0、I2C、UART 等对带宽敏感的线路。
  • 双向保护结构:无极性要求,适用于双向数据线或可能出现正负电压摆幅的接口。
  • 高能量吸收能力:Ppp = 60 W(8/20 μs),可承受常见浪涌与雷击诱发的短时脉冲能量。
  • 低漏电流:Ir = 500 nA,可用于对静态功耗敏感的系统或带有精密模拟输入的场合。
  • 小型封装:DFN1006 芯片级面积,利于节省 PCB 空间,适合手机、平板、可穿戴设备等紧凑设计。

四、典型应用场景

  • USB/串口接口保护(5 V 类接口)
  • 智能终端的外部信号线防护(按键、触摸、SIM 卡接口)
  • 工业控制与传感器的信号入口防护(低速差分或单端线)
  • 通信设备、模块化接口的 ESD 防护节点
    说明:由于为单路器件,若需多路保护可并排布置多个芯片或选择多通道解决方案。

五、封装与 PCB 布局建议

  • 芯片封装:DFN1006,适合自动化贴装与回流焊工艺。
  • 布局要点:
    • 将 Rclamp0531T-N 尽量靠近被保护的连接器或信号输入点放置,以缩短受保护点到器件的走线长度,减小感性耦合。
    • 在器件与地之间保持直接且低阻抗的回路,使用充足的地平面或专用接地焊盘;必要时在器件下方或附近布置过孔与底层接地相连。
    • 避免在保护器件与信号源之间串入较长的走线或大环路,以免降低 ESD 效果。
    • 若信号需经过滤波或匹配网络,可在保护器件与滤波元件之间保留匹配阻抗或使用小电阻分流以改善能量分配。

六、使用注意事项与选型要点

  • 额定工作电压 Vrwm = 5 V,适用于 5 V 及以下的信号线;若系统存在更高直流偏置,请确认器件不会频繁进入击穿区。
  • 钳位电压较高(15 V),在设计时应确保后端电路能承受该短时电压峰值,或者在后端添加次级保护/限流元件。
  • 峰值脉冲电流 3.5 A 适合常规 ESD 事件与中等能量浪涌;对更高能量冲击(例如工业级雷击)可考虑并联或选用更高功率等级的器件。
  • 双向结构适合无方向性电压的通用信号线,若用于单向电源线保护应确认方向性需求。
  • 该器件适合替代或与 TVS 二极管配合使用,构建层级防护策略:靠近接口放置 TVS,后端用更高能量吸收器件保护整机。

Rclamp0531T-N 以其小封装、低容抗和符合 IEC 标准的防护性能,为对空间与信号完整性有较高要求的应用提供了兼顾性能与成本的解决方案。对于追求体积最小化但又需可靠 ESD/浪涌防护的产品设计,Rclamp0531T-N 是一个常用且实用的选择。

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