WMSIC Electronic Components

BORN BNESD351DPYR

ModelBNESD351DPYR
PackageDFN1006-2L
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BNESD351DPYR
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BNESD351DPYR
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.008g
Electronic Component
1
Cj- Capacitor
1pF
Electronic Component
BM0265006881
Operating Temperature
55℃~+150℃
Voltage
6V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BNESD351DPYR 产品概述

一、产品简介

BNESD351DPYR 是 BORN(伯恩半导体)推出的一款高性能单向 TVS ESD 保护二极管,采用超小型 DFN1006-2L 封装。该器件针对 3.3V 系统优化,具备极低结电容(Cj ≈ 1 pF),适合高速数据线和敏感接口的瞬态过压与静电放电保护。产品通过 IEC 61000-4-2、IEC 61000-4-4 和 IEC 61000-4-5 等电磁兼容性测试要求,可靠性高,便于在移动设备、通信与工业接口中部署。

二、主要参数(关键规格)

  • 极性:单向
  • 反向截止电压 Vrwm:3.3 V
  • 击穿电压 VBR:6.5 V
  • 钳位电压(典型):6 V
  • 峰值脉冲电流 Ipp:10 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:60 W @ 8/20 μs
  • 反向电流 Ir:100 nA(在 Vrwm 条件下)
  • 结电容 Cj:1 pF(低容性,利于高速信号完整性)
  • 封装:DFN1006-2L(超小 2 引脚)
  • 类型:ESD(保护器)
  • 防护等级:符合 IEC 61000-4-2/4-4/4-5

三、电气特性解析

BNESD351DPYR 的 Vrwm = 3.3 V 使其在 3.3V 数字和接口电路中处于反向截止状态,平时不影响信号传输。遇到高压瞬态时(如静电放电或浪涌),器件在 VBR ≈ 6.5 V 附近进入雪崩导通,并在规定脉冲下将电压钳位到约 6 V,有效限制到达下游电路的能量。10 A@8/20 μs 的冲击承受能力和 60 W 的脉冲功率能力,能应对常见的工业级脉冲与人体模型 ESD 事件。1 pF 的超低结电容特别适合 USB、MIPI、HDMI、SATA、差分高速线等对信号完整性要求高的场景。

四、典型应用场景

  • 移动终端与便携设备的 I/O 接口(3.3V 电平)
  • 高速数据线(USB/DP/HDMI 差分接口)或射频前端附近的静电保护
  • 工业通信接口和控制信号线(要求抗脉冲与 ESD)
  • 模块化设计中靠近连接器的浪涌/ESD 保护元件

五、封装与 PCB 布局建议

  • 尽量将 BNESD351DPYR 布置在被保护引脚与连接器之间,靠近连接器或信号输入端,缩短环路长度以减小感性耦合。
  • 单向器件应将阴极(通常标识为一侧)接至受保护信号线,阳极接地;在正常工作电压下保持反向偏置。
  • 地线应尽量低阻低感,必要时在地附近布置多条过孔将保护器件附近的参考地与系统地连接,确保冲击电流的回流路径短而稳定。
  • 小封装易于贴片生产,焊盘设计应参考厂方推荐焊盘(DFN1006-2L),并遵循回流焊温度曲线。

六、选型建议与使用注意

  • 若系统对信号完整性要求极高且承受更大浪涌能力,可以考虑并联或选择更高 Ipp/Ppp 等级的器件;但并联需注意热一致性与匹配。
  • 对于双向保护需求,请选择相应双向 TVS 器件;本型号为单向,适合对地保护架构。
  • 虽然器件符合多个 IEC 标准,但实际系统保护性能还依赖于 PCB 布局、接地设计以及外部串联/限流措施(如阻容、熔断器等)。

七、可靠性与测试

BNESD351DPYR 已针对 ESD、EFT 和浪涌等典型电磁干扰进行了设计验证,适用于商业与工业级的应用环境。出厂前应按照实际应用的电压/温度/脉冲工况进行板级测试,确认钳位行为、漏电和信号完整性满足系统需求。

总结:BNESD351DPYR 以其小体积(DFN1006-2L)、低结电容(1 pF)、针对 3.3V 线路优化的 Vrwm 和优秀的脉冲承载能力(10 A@8/20 μs,60 W)成为保护高速接口和敏感电路的理想选择。在实际应用中,合理的 PCB 布局和接地设计将极大提升其保护效果与系统稳定性。

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