WMSIC Electronic Components

BORN BNESD9X5.0ST5G

ModelBNESD9X5.0ST5G
PackageDFN1006-2(SOD-882)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BNESD9X5.0ST5G
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BNESD9X5.0ST5G
Electronic Component
1
Package
DFN1006-2(SOD-882)
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
50pF
Electronic Component
BM0263578209
Voltage
12V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BNESD9X5.0ST5G 产品概述

一、产品简介

BNESD9X5.0ST5G 是伯恩半导体(BORN)推出的一款单路单向 TVS 二极管,专为 5V 轨电源及信号线静电/浪涌防护而设计。器件采用超小型 DFN1006-2(SOD-882,俗称 0402)封装,占板面积小,适合移动设备、物联网模块和高密度 PCB 布局的保护需求。

二、主要参数

  • 极性:单向
  • 反向工作电压 Vrwm:5V
  • 击穿电压 VBR:约 7.2V
  • 钳位电压(典型):12V
  • 峰值脉冲电流 Ipp:7A(8/20μs)
  • 峰值脉冲功率 Ppp:70W(8/20μs)
  • 反向泄漏电流 Ir:500nA(常温)
  • 结电容 Cj:约 50pF
  • 通道数:单路
  • 类型:ESD(瞬态抑制)
  • 防护等级:符合 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 规范
  • 封装:DFN1006-2(SOD-882 / 0402)
  • 品牌:BORN(伯恩半导体)

三、核心特性

  • 极小封装:0402/DFN1006-2 尺寸,节省 PCB 面积,利于高密度设计和便携终端应用。
  • 高效能瞬态吸收:在 8/20μs 浪涌波形下,70W 的峰值功率和 7A 峰值脉冲电流提供可靠的瞬态能量吸收能力。
  • 低泄漏、快速响应:典型反向电流仅 500nA,配合 TVS 的快速钳位动作,可在 ESD 事件中迅速保护后级元件。
  • 中等结电容(≈50pF):在多数低速或中速数据线(控制信号、UART、I2C、GPIO、电源线)上不会显著影响信号完整性;对超高速差分信号线选择时需评估。
  • 符合工业级抗扰标准:通过 IEC 61000-4-2、4-4、4-5 等测试,可应对静电放电、快速瞬变脉冲及浪涌事件。

四、典型应用

  • 手机、平板、穿戴设备的 USB/充电口、按键和外部接口保护
  • IoT 终端、蓝牙/Wi‑Fi 模块的 I/O 口和天线接口前端保护(需结合系统要求评估)
  • 工控和仪表中的信号采集输入、控制线防护
  • 摄像头模块、传感器接口、存储卡插槽保护

五、设计与布局建议

  • 靠近被保护端口或连接器放置 TVS 二极管,以缩短寄生环路,提升防护效率。
  • TVS 的地引脚应通过低阻、低感抗回流路径接地,避免长地线。
  • 对高速差分信号如 USB3.0、HDMI 等,建议评估 50pF 电容对信号带宽的影响,必要时选择更低容抗的器件或在差分对外侧分配保护元件。
  • 在高浪涌场景下,可与系列阻抗元件(如小电阻)或共模滤波器配合使用,提升整体保护能力。

六、封装与可靠性

DFN1006-2(SOD-882 / 0402)超小封装适合自动贴装与回流焊工艺,满足现代电子产品对体积与可靠性的双重要求。器件通过 IEC 静电与浪涌测试认证,可靠性适合消费、工业及通信类电子设备的静电防护设计。

总结:BNESD9X5.0ST5G 以其小体积、高吸收能力和低泄漏特性,适合在 5V 轨及常见 I/O 接口上实现有效的静电与浪涌保护。在应用于高速信号时,请结合结电容参数进行信号完整性评估与布局优化。

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