WMSIC Electronic Components

BORN PESD12VS1UL-N

ModelPESD12VS1UL-N
PackageDFN1006-2
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN PESD12VS1UL-N
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
PESD12VS1UL-N
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.017g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
70pF
Electronic Component
BM0264222516
Voltage
25V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
200nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD12VS1UL-N 静电保护二极管产品概述

一、产品核心定位与设计初衷

PESD12VS1UL-N是伯恩半导体(BORN) 针对低电压电子系统开发的单向ESD防护器件,核心目标是解决电路中静电放电(ESD)、电快速瞬变脉冲群(EFT)及浪涌干扰带来的可靠性问题。器件专为12V供电系统优化,可有效保护MCU、传感器、通信接口等敏感元件,降低因静电/浪涌导致的设备故障、数据丢失或硬件损坏风险,适配消费电子、通信、工业控制等多领域的小型化产品需求。

二、关键电气性能参数深度解析

器件的核心参数围绕“防护有效性+电路兼容性”平衡设计,关键指标如下:

1. 工作电压与截止特性

  • 反向截止电压(Vrwm)12V:匹配12V供电电路的长期工作电压,正常状态下器件处于截止态,不影响电路信号传输;
  • 击穿电压17V:略高于工作电压,确保电路电压波动时器件不会误触发,仅在浪涌/静电发生时导通泄放能量;
  • 反向漏电流(Ir)200nA:漏电流极小,避免对电路功耗、信号精度造成干扰,适合低功耗场景(如IoT终端)。

2. 浪涌防护能力

  • 峰值脉冲电流(Ipp)10A@8/20μs:可泄放8/20μs浪涌波形下的10A峰值电流,覆盖雷电感应、电源开关等常见浪涌场景;
  • 峰值脉冲功率(Ppp)250W:对应10A×25V的能量承载能力,能快速 dissipate 浪涌能量;
  • 钳位电压25V:浪涌发生时将电路电压钳位在25V以内,远低于多数敏感元件的损坏阈值(如MCU损坏阈值多在30V以上),为后端元件提供可靠屏障。

3. 信号兼容性

  • 结电容(Cj)70pF:处于低电容范围,适合音频接口、低速数据总线(UART、I2C)等信号线路,不会导致信号失真或传输延迟,兼顾防护与信号完整性。

三、国际标准防护认证与可靠性

器件通过IEC 61000-4系列核心防护标准验证,覆盖三大常见干扰场景:

  • IEC 61000-4-2(ESD防护):应对人体接触放电、空气放电等日常静电场景;
  • IEC 61000-4-4(EFT防护):抑制汽车点火、工业设备开关产生的快速瞬变脉冲群;
  • IEC 61000-4-5(浪涌防护):抵御雷电感应、电源线路浪涌冲击。

此外,器件采用伯恩半导体高可靠性工艺制造,长期工作稳定性强,可满足工业级(-40℃85℃)与消费级(0℃70℃)环境需求。

四、DFN-2L封装的技术优势

采用DFN-2L(双列扁平无引脚)封装,具备三大核心优势:

  1. 小尺寸紧凑:封装体积仅几平方毫米,节省PCB空间,适配智能手机、可穿戴设备等小型化产品;
  2. 低寄生参数:无引脚设计降低寄生电感/电阻,提升高频响应速度,防护触发更及时;
  3. 散热性能优异:封装直接贴合PCB铜箔,散热路径短,可快速导出浪涌产生的热量,避免器件过热损坏。

五、典型应用场景

PESD12VS1UL-N的参数与封装特性使其适配多场景:

  • 消费电子:智能手机、平板、无线耳机的充电口、音频口、数据接口防护;
  • 通信设备:路由器、IoT模块、基站信号接口的静电浪涌防护;
  • 工业控制:PLC模块、传感器节点、低电压控制电路的干扰抑制;
  • 汽车电子(低电压部分):车载显示屏、CAN总线分支接口的12V系统防护。

总结

PESD12VS1UL-N平衡了防护能力、信号兼容性与封装尺寸,是12V低电压系统静电浪涌防护的高性价比选择。伯恩半导体的工艺可靠性与国际标准认证,使其可稳定应用于消费、通信、工业等多领域,助力终端产品提升抗干扰能力与使用寿命。

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