WMSIC Electronic Components

BORN TPD2EUSB30DRTR-N

ModelTPD2EUSB30DRTR-N
PackageSOT-723
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN TPD2EUSB30DRTR-N
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
TPD2EUSB30DRTR-N
Electronic Component
1
Package
SOT-723
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.006g
Electronic Component
1
Cj- Capacitor
0.6pF
Electronic Component
BM0264897288
Voltage
14V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPD2EUSB30DRTR-N 产品概述

一、概览

TPD2EUSB30DRTR-N 是 BORN(伯恩半导体)推出的一款小型单向静态硅雪崩(TVS)二极管,专为高速数字接口的瞬态过电压保护而设计。器件采用 SOT-723 超小封装,具有低结电容(Cj = 0.6 pF)、低泄漏电流和较低钳位电压的特性,能够在机顶盒、数字电视及类似消费电子产品中,对 USB / 信号线进行高效的静电和浪涌防护。

二、主要电气参数

  • 极性:单向(unidirectional)
  • 反向稳态工作电压 Vrwm:5 V
  • 击穿电压 VBR:6 V
  • 钳位电压(典型):14 V
  • 峰值脉冲电流 Ipp:4 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:56 W @ 8/20 μs
  • 反向电流 Ir:100 nA(常温下)
  • 结电容 Cj:0.6 pF
  • 防护类型:ESD / 浪涌 / 快速瞬变
  • 符合标准:IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5
    • IEC 61000-4-2 抗扰度:空气放电 ±25 kV,接触放电 ±20 kV

三、核心特性与优势

  • 低结电容(0.6 pF):对高速信号线影响小,适合用于 USB、HDMI、LVDS 等高速差分/单端信号的ESD保护。
  • 单向配置:适用于有明确电源极性(例如 USB 5 V 线路)且需将过电压安全导向地线的场合。
  • 低泄漏电流(100 nA):在待机或低功耗模式下对系统电流影响极小。
  • 较低钳位电压(14 V):在静电放电或脉冲事件时能将电压限制在器件可承受范围内,保护后级器件不被高压击穿。
  • 小封装(SOT-723):适合空间受限的消费类电子产品,便于在紧凑 PCB 布局中使用。

四、典型应用场景

  • 数字电视与机顶盒:保护 USB、遥控接收器或其他外部接口免受静电和浪涌损伤。
  • 消费类便携设备:对小尺寸主板上的高速接口提供局部防护。
  • 高速数据接口:适合在需要低影响电容的信号线上提供 ESD 抑制。
  • 其他需要满足 IEC 61000-4 系列抗扰度要求的电子系统。

五、封装与布局建议

  • 封装:SOT-723,适用于自动贴装与小间距 PCB 设计。
  • 布局建议:器件应尽量靠近被保护的输入/输出引脚放置,输入引脚与保护器之间走线长度要短且宽(金属化),避免形成高阻抗回路。接地端应采用低阻抗大面积地平面,并在靠近器件处布置多个过孔(vias)回到主地平面,以提高瞬态能量的散逸能力。若用于差分信号线(如 USB),尽量在每一条线分别配置保护或按制造商推荐的差分保护方案布局。
  • 旁路与滤波:若系统对信号完整性要求极高,可在保护器前后评估是否需要与滤波网络(阻容)配合,但需注意额外元件可能改变带宽与时延。

六、设计注意事项

  • 能力匹配:该器件在 8/20 μs 波形下 Ppp = 56 W、Ipp = 4 A,适合 ESD 与中小能量浪涌;对于高能量雷击或直击浪涌,建议采用更高能量等级的浪涌保护器或分级保护设计。
  • 单向特性:确认被保护线路电压极性以避免误用双向保护场合。
  • 温度与老化:长期工作在高温与频繁冲击环境下,钳位能力与泄漏特性可能随时间变化,应在关键应用中进行环境应力验证。
  • 系统验证:在样机阶段做 IEC 61000-4-2 / 4-4 / 4-5 等实测,验证实际的 PCB 布局与接地实践是否满足抗扰度要求。

七、合规与可靠性

TPD2EUSB30DRTR-N 满足 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)及 IEC 61000-4-5(浪涌)等工业级抗扰度标准中的要求,且器件本身采用固态硅雪崩技术,具有可重复防护能力,适合要求一定抗扰度的消费电子与嵌入式系统。

八、结论

TPD2EUSB30DRTR-N 以其低结电容、低泄漏、单向钳位以及 56 W 峰值脉冲功率的能力,适合在空间受限且需保护高速信号/5 V 线路的终端设备中使用。合理的 PCB 布局与接地设计能够最大化其保护效果。对于需要更高能量承受能力的场合,可考虑并联或上级分级防护方案以满足更严格的浪涌要求。

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