WMSIC Electronic Components

BORN BEP0080TB-MC

ModelBEP0080TB-MC
PackageSMA
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BEP0080TB-MC
Type
BORN
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BEP0080TB-MC
Electronic Component
1
Package
SMA
Electronic Component
Thyristor Surge Suppressor (TSS)
Electronic Component
0.543g
Current
5uA
Electronic Component
1
Electronic Component
BM0230596454
Operating Temperature
40℃~+150℃
Latching Current(Ih)
50mA
Switch Voltage(Vs)
25V
Capacitor(Co)
25pF
Voltage(Vt)
4V
Current(It)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BEP0080TB-MC 产品概述

一、产品简介

BEP0080TB-MC 是 BORN(伯恩半导体)出品的一款小型放电管(气体放电抑制器),SMA 封装,专为低压、瞬态过电压保护设计。器件在静态状态下呈高阻,遇到瞬态冲击时迅速导通,将能量安全引入接地或回路以保护后端电路。典型应用包括通信线路、数据接口、低压电源和信号防雷防浪涌保护。

二、主要参数(典型值)

  • 断态峰值电压 Vdrm:6 V
  • 开关电压 Vs:25 V
  • 峰值脉冲电流 Ipp:80 A
  • 漏电流:5 μA
  • 保持电流 Ih:50 mA
  • 通态电压 Vt:4 V
  • 通态电流 It:2.2 A
  • 断态电容 Co:25 pF
  • 工作温度范围:-40 ℃ ~ +150 ℃
  • 封装:SMA

三、产品特点

  • 高脉冲承受能力:80 A 峰值脉冲能力,适合短时大能量冲击环境。
  • 低漏电:5 μA,适合对静态功耗敏感的电路。
  • 低断态电容(25 pF):对高速信号线(如通信或数据线)影响小,能在不明显降低信号完整性的前提下提供保护。
  • 小封装设计(SMA):便于表面贴装、体积小、适合批量生产和自动贴片工艺。
  • 宽温度适应:-40~+150 ℃,可在工业级环境工作。

四、典型应用场景

  • 电话/DSL/串行通信接口防浪涌保护
  • 数据总线、以太网边界保护(适用于需要低电容的场合)
  • 低压直流电源和点对点保护模块
  • 工业控制器和传感器接口的瞬态抑制

五、选型与设计建议

  • 匹配系统电压:断态峰值电压 Vdrm=6V,适合极低工作电压线路;选择前确认系统常态电压低于该值以避免误触发。
  • 与其他防护器件配合:在更高能量冲击或更严格的夹断要求下,可与瞬态抑制二极管(TVS)串并联配合使用,利用放电管承受大能量、TVS 控制峰值电压的策略。
  • 对高速信号线布局要考虑最短回流路径和最小寄生电感,利用器件低电容优势减少对信号的影响。
  • PCB 安装:SMA 贴片封装,应按推荐焊盘尺寸布板,焊接时遵循制造商回流曲线以保证焊点质量。

六、可靠性与注意事项

  • 放电次数与能量:放电管耐受单次大电流脉冲能力强,但重复高能量冲击会逐步削弱器件特性;在高频率冲击环境下需评估寿命与更换策略。
  • 温度影响:高温可能影响触发特性和保持电流,长期工作在高温边界需考虑散热与降额设计。
  • 极性与接地:按设计规范接地并确保良好接触,避免地线电阻导致夹断后电位上升。
  • 机械应力:SMA 小封装对焊接和机械应力敏感,生产与维修时注意避免过热与弯折。

七、封装与订购

  • 封装形式:SMA(表面贴装)
  • 订购信息:型号 BEP0080TB-MC,品牌 BORN(伯恩半导体)。购买与批量应用前建议向厂商确认最新规格书、器件放电能量曲线及焊接工艺参数。

如需进一步的波形数据、脉冲试验曲线或推荐 PCB 焊盘样式图,可联系供应商获取完整数据手册,以便在实际设计中做更精细的电磁兼容与寿命评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.