Model & package intelligence
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BORN BDFN2C071V
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BDFN2C071V
- Type
- BORN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BDFN2C071V
- Electronic Component
- 1
- Package
- DFN1006
- Electronic Component
- Electronic Component
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.006g
- Electronic Component
- 1
- Cj- Capacitor
- 15pF
- Electronic Component
- BM0226246925
- Voltage
- 12V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 7.5V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BDFN2C071V 产品概述
一、概述
BDFN2C071V 是 BORN（伯恩半导体）推出的双向瞬态抑制二极管（TVS），采用小型 DFN1006 封装，专为对抗静电放电（ESD）、电快速瞬变（EFT）和雷击/浪涌（Surge）而设计。器件符合 IEC 61000-4-2、IEC 61000-4-4 与 IEC 61000-4-5 等工业级抗扰度要求，适用于对体积、响应速度和电容有严格要求的保护场合。
二、主要电气参数
- 钳位电压（Vcl）：12 V（典型，Ipp=8A@8/20μs）
- 击穿电压（Vbr）：7.5 V
- 反向截止电压（Vrwm）：7 V（工作电压上限）
- 峰值脉冲电流（Ipp）：8 A @ 8/20 μs
- 结电容（Cj）：15 pF（低电容，适合高速信号线）
- 反向漏电流（Ir）：1 μA（在 Vrwm 条件下）
- 极性：双向
三、主要特性与优势
- 抗扰能力强：通过 IEC 61000-4 系列测试，能有效保护接口和电源线免受 ESD/EFT/Surge 损伤。
- 低结电容（15 pF）：对高速数据线（例如 USB2.0、HDMI、LVDS 等）影响小，信号失真低。
- 小尺寸封装 DFN1006：节省 PCB 空间，适合集成度高的终端设备。
- 双向保护：无需外加极性识别，适合交流耦合信号或双向数据线保护。
四、应用场景
- 消费电子：智能手机配件、平板、笔记本外围接口保护。
- 通讯设备：路由器、网关、以太网接口（非高压供电线路）保护。
- 工业控制：传感器输入、低压控制线的瞬态过压防护。
- 汽车电子（非直接车载高压供电回路）：对 5V/7V 类信号线的保护（需按系统要求验证）。
五、设计与布局建议
- 尽量将 TVS 靠近被保护的连接器或器件引脚放置，减少走线感应引入的干扰。
- 对地端使用低阻抗连续接地面，并在必要处添加过孔以改善散热与回流。
- 对高速差分信号采用对称布局，避免引入阻抗不连续。
- 若系统工作电压接近 Vrwm，应选择有适当裕度的 TVS 或使用限流/滤波措施。
六、可靠性与选型提示
- 在选型时考虑最大脉冲能量和系统可能承受的浪涌幅值：8A@8/20μs 适合中等能量浪涌场景。
- 当系统要求更低电容或更高能量脉冲承受能力时，可参考同系列其它型号或并联/串联组合方案（需评估热与电应力）。
- 封装和标识：DFN1006 小封装，适用于自动贴装与回流焊工艺。
如需器件原始数据手册、典型波形图或 PCB 封装库文件（Footprint/3D），可进一步提供，我将协助准备。
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