WMSIC Electronic Components

BORN SMBJ33CA

ModelSMBJ33CA
PackageDO-214AA(SMB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMBJ33CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMBJ33CA
Electronic Component
1
Package
DO-214AA(SMB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.197g
Electronic Component
1
Electronic Component
BM0226248555
Operating Temperature
55℃~+150℃
Voltage
53.3V
Current(Ir)
1uA
Voltage(VBR)
40.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ33CA 产品概述(BORN / 伯恩半导体)

一、概述

SMBJ33CA 为 BORN(伯恩半导体)出品的双向瞬态电压抑制器(TVS),型号 SMBJ33CA(封装 DO-214AA / SMB)。器件主要用于抑制静电放电(ESD)和脉冲浪涌,保护敏感电子线路免受过电压瞬变损害。工作温度范围宽(-55℃ 至 +150℃),适合工业级及严苛环境应用。

二、主要规格

  • 类型:TVS(二极管,双向)
  • 反向截止电压 Vrwm:33 V(稳态工作电压)
  • 击穿电压(典型):40.6 V
  • 钳位电压(典型,10/1000 μs):53.3 V
  • 峰值脉冲功率 Ppp:600 W(10/1000 μs)
  • 峰值脉冲电流 Ipp:11.3 A(10/1000 μs)
  • 反向电流 Ir:1 μA(常温、Vrwm 下)
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:DO-214AA (SMB)

三、关键特性

  • 双向保护:对正、负向瞬态电压均可钳制,适合交流或两向扰动场合。
  • 高能脉冲吸收能力:10/1000 μs 波形下可承受 600 W 峰值能量,同时 Ipp 达 11.3 A,能有效吸收中低频能量较大的浪涌。
  • 低漏流:在 Vrwm 下反向电流仅 1 μA,有利于低功耗电路长期使用。
  • 宽温度范围:适配车规/工业级温度要求(需结合系统认证确认)。

四、典型应用

  • 24 V 供电总线与工业控制系统的浪涌保护(Vrwm=33 V 适配 24 V 系统有余量)。
  • 通信接口、串口、以太网端口的过压防护(需按线路类型选择单/双向器件)。
  • 电源输入、逆变/UPS 接口、电机驱动器等受雷击或开关瞬变影响的场合。
  • 汽车电子与车载设备(在满足相关认证与车规要求下)。

五、选型与使用建议

  • 若保护对象为单向直流供电(例如方向性稳压线路),可优先考虑单向 TVS;SMBJ33CA 为双向,适合两极性瞬变或交流场合。
  • 钳位电压选择:钳位电压 53.3 V(典型)应低于被保护元件的耐压上限,但高于正常工作电压。对 24 V 系统通常为合适选择,但需确认安全裕量。
  • PCB 布局:将 TVS 放置在靠近浪涌入口(如连接器或电源引脚)的位置,走线尽量短且粗,降低寄生电感;必要时配合阻尼元件或熔断器使用。
  • 散热与多次冲击:高能量冲击可能产生热应力,评估重复脉冲情况下器件温升并考虑热散措施或并联降压方案。

六、封装与可靠性

  • 封装 DO-214AA(SMB)适合手动焊接与回流工艺,常见于中功率保护件布局。生产与焊接时遵循厂家回流温度曲线与湿热防潮规范。
  • 长期可靠性受工作环境、冲击次数与能量影响,建议在系统设计阶段预估最大可能浪涌能量并留有安全裕度。

本产品以其高脉冲能量吸收能力、双向保护特性和宽温度范围,适用于需要对中高能瞬态浪涌进行可靠抑制的工业与车载类电子设备。若需典型波形试验数据或器件详尽曲线(IV、钳位随电流变化等),可进一步索取详尽数据手册。

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