Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN PESD5V0X1BL-N
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN PESD5V0X1BL-N
- Type
- BORN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- PESD5V0X1BL-N
- Electronic Component
- 1
- Package
- DFN1006
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.7pF
- Electronic Component
- BM0257712162
- Voltage
- 20V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 100nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD5V0X1BL-N 产品概述
一、产品简介
PESD5V0X1BL-N 是 BORN（伯恩半导体）推出的一款单路双向 TVS 二极管，采用 DFN-1006 超小封装，专为 5V 系统与高速信号线的静电防护设计。该器件在满足 IEC 61000-4-2 标准的同时，具备低结电容和极低漏电流，适用于移动设备、接口端口和各种电子模块的瞬态浪涌与 ESD 防护。
二、主要电气参数
- 极性：双向（适合交流或差分信号保护）
- 反向截止电压 Vrwm：5 V（工作电压等级）
- 钳位电压：20 V（在规定脉冲条件下的典型钳位）
- 峰值脉冲电流 Ipp：7 A @ 8/20 μs
- 峰值脉冲功率 Ppp：120 W @ 8/20 μs
- 反向电流 Ir：100 nA（低漏电，适合待机功耗敏感应用）
- 通道数：单路
- 防护等级：符合 IEC 61000-4-2 ESD 要求
- 结电容 Cj：0.7 pF（极低电容，保持信号完整性）
- 封装：DFN1006（超小尺寸，有利于高密度 PCB 布局）
三、功能特点与优势
- 双向保护：可在正负方向对称钳制突波，适用于差分和双向信号线。
- 低电容：0.7 pF 的结电容对高速数据线影响微小，适合 USB、触摸屏接口、I/O 信号线等高速/高频应用。
- 高瞬态能量吸收能力：在 8/20 μs 波形下可承受 7 A 脉冲电流与 120 W 峰值功率，能够有效吸收雷击、开关冲击等瞬态能量。
- 低漏电流：100 nA 的反向电流保证待机功耗低，适合便携式与低功耗系统。
- 小体积封装：DFN1006 有利于空间受限产品的布板与多通道保护部署。
四、典型应用场景
- USB、Micro-USB、Type-C 等 5V 接口的端口保护。
- 移动终端、可穿戴设备和便携式电子产品的 I/O 口防护。
- 工业控制、家电与车载电子中对单路信号的 ESD 防护。
- 高速数据线和差分对的保护场合，需兼顾信号完整性的场景。
五、布局与使用建议
- 将 TVS 尽量靠近被保护的端口或连接器放置，以缩短 ESD 电流回路。
- 为获得最佳放电路径，器件的接地端应采用多过孔接地或靠近大地平面连接，确保低阻抗回路。
- 对于差分信号，推荐在两条线之间并联使用双向 TVS 或按资料中的推荐接法布置。
- 注意焊接与回流工艺的温度曲线，避免过热影响器件性能；装配时遵循厂商推荐的 PCB 封装尺寸与焊盘设计。
六、封装与订购信息
- 品牌：BORN（伯恩半导体）
- 型号：PESD5V0X1BL-N
- 封装：DFN1006（超小型）
- 通道数：单路，双向 ESD 类型
PESD5V0X1BL-N 以其小尺寸、低电容和高脉冲吸收能力，为要求空间紧凑且需保持信号完整性的 5V 接口提供可靠的瞬态防护解决方案。购买与选型时，请参考具体的器件数据手册以获取详细的电压-电流曲线、钳位特性及 PCB 推荐封装尺寸。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
