WMSIC Electronic Components

BORN 5.0SMDJ30A

Model5.0SMDJ30A
PackageSMC(DO-214AB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 5.0SMDJ30A
Type
BORN
Minimum package
3000

Technical parameters

Electronic Component
BORN
Electronic Component
5.0SMDJ30A
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.401g
Electronic Component
1
Electronic Component
BM0231019378
Operating Temperature
55℃~+150℃
Voltage
48.4V
Current(Ir)
1uA
Voltage(VBR)
36.8V
Electronic Component
3000
Power(Ppp)
5kW@10/1000us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5.0SMDJ30A 产品概述

5.0SMDJ30A 是 BORN(伯恩半导体)出品的一款高能量瞬态电压抑制二极管(TVS),采用 SMC(DO-214AB)表面贴装封装,针对电源线和信号线的浪涌、雷击和开关瞬态提供可靠的单向钳位保护。该器件设计用于在工业、通信、汽车及电源管理系统中吸收大能量脉冲并将瞬态电压钳制在安全范围内,保护下游电子元件免受损坏。

一、主要电气参数与含义

  • 极性:单向(Unidirectional)—— 对正向瞬态进行钳位,适用于直流电源保护场合。
  • 反向截止电压 Vrwm:30 V —— 建议持续工作电压或直流母线电压不超过此值。
  • 击穿电压(Vbr):36.8 V —— 在标准测试电流下开始进入雪崩击穿区。
  • 钳位电压 Vc:48.4 V —— 在峰值脉冲条件(10/1000 μs)下对应的极限钳位电压,表示器件在吸收指定脉冲电流时的最大电压水平。
  • 峰值脉冲电流 Ipp:103 A @ 10/1000 μs —— 表示在 10/1000 μs 能量波形下器件可承受的峰值脉冲电流能力。
  • 峰值脉冲功率 Ppp:5 kW @ 10/1000 μs —— 对应上面电压与电流下的最大瞬间吸收能量能力(近似 Vc × Ipp)。
  • 反向电流 Ir:1 μA —— 在 Vrwm 下的典型泄漏电流,适合要求低漏电的电源系统。
  • 工作温度范围:-55 ℃ 到 +150 ℃ —— 满足宽温域应用与高可靠性环境要求。
  • 类型:TVS(瞬态抑制二极管),用于瞬态浪涌能量吸收。

二、产品特性与优势

  • 高能量吸收:5 kW 的峰值脉冲功率和 103 A 的脉冲电流能力,使其能承受工业级浪涌与雷击情形下的大能量冲击。
  • 有效钳位:48.4 V 的钳位电压在保护 30 V 级别电源(如 24 V 系统)时,能将瞬态电压限制在可接受范围,从而保护下游电子元件。
  • 低漏电流与宽温工作:1 μA 的反向电流和 -55~+150 ℃ 的工作温度范围,适用于对漏电和温度可靠性有较高要求的场合。
  • SMC 表面贴装封装:便于自动化装配,良好的热散能力,适合高功率吸收时的热管理。

三、典型应用场景

  • 工业控制设备:24 V 直流电源母线防护、PLC、电机驱动控制端口。
  • 电源与配电模块:AC/DC 或 DC/DC 转换器入口的浪涌抑制。
  • 通信和网络设备:冗余电源输入、交换设备电源保护(单向适用于直流供电系统)。
  • 汽车电子(符合温度等级要求的非严格汽车级场合):车载辅助电源和电子模块的瞬态抑制(需结合车规认证考虑)。
  • 储能与太阳能逆变器辅助线路防护。

四、选型建议与注意事项

  • 工作电压匹配:选择 Vrwm 稍高于系统正常工作电压(例如 24 V 系统选 30 V Vrwm),以避免常态下导通。
  • 钳位裕度考虑:钳位电压应低于被保护器件或电路的最大承受电压;若钳位稍高,可通过并联或级联保护与滤波器配合来降低实际到达的峰值。
  • 冲击能量与频率:虽然器件能承受高能量脉冲,但反复多次或长时间频繁冲击会累积热应力,应根据实际浪涌谱考虑冗余设计或外加串联阻抗。
  • 封装与散热:SMC 封装具备良好散热,应在 PCB 设计上增加铜箔面积和必要的过孔以提高散热能力,保证在高能量吸收时不会超出结温限制。
  • 焊接与工艺:遵循厂商推荐的回流温度曲线进行焊接,避免超过封装的热应力限制。

五、安装与可靠性建议

  • 建议靠近被保护端口或靠近电源输入处布置,以最小化未受保护导线的长度,从而降低感应过压。
  • 为长期可靠性,避免将器件长期工作在临界 Vrwm 附近,留有足够的电压裕度。
  • 在高冲击环境(如雷击频繁区域)可考虑与熔丝、PPTC 或气体放电管配合使用,实现多级保护与故障隔离。
  • 常规环境与温度循环测试有助于验证在目标应用中的实际寿命和可靠性。

六、订购信息与封装

  • 型号:5.0SMDJ30A
  • 品牌:BORN(伯恩半导体)
  • 封装:SMC / DO-214AB(表面贴装)
  • 适用标准脉冲测试:10/1000 μs 波形下的 Ipp 与 Ppp 标注

总结:5.0SMDJ30A 为针对 30 V 级直流系统提供高能量瞬态抑制的可靠解决方案,兼具高脉冲吸收能力、低漏电和宽温工作范围。适用于工业电源、通信设备和电源入口的浪涌保护,在选型与 PCB 热管理上稍作注意,可以为系统提供长期稳定的防护。若需更详细的温度系数、封装尺寸图或焊接曲线,请参考厂商样本或联系供应商获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.