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BORN BZT52C15S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BZT52C15S
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BZT52C15S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzk)
- 200Ω
- (Zzt)
- 30Ω
- Electronic Component
- BM0226525739
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 13.8V~15.6V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C15S 产品概述
一、产品简介
BZT52C15S（品牌：BORN/伯恩半导体）是一款独立式小功率稳压二极管，名义稳压值为15V，允许稳压范围为13.8V～15.6V。器件采用SOD-323表面贴装封装，适用于空间受限的低功耗电源稳压、基准电压与浪涌钳位场合。器件反向泄漏电流极小（[email protected]），便于在小电流电路中提供稳定参考。
二、主要电气参数
- 名义稳压：15V（允许范围13.8V～15.6V）
- 反向泄漏电流 Ir：100 nA @ 10.5V（典型小功耗电路优选）
- 动态阻抗 Zzt：30 Ω（在规定测试电流下的交流小信号阻抗）
- 膝部阻抗 Zzk：200 Ω（低电流区的非线性特性指标）
- 最大功耗 Pd：200 mW（器件在环境温度和散热条件下的耗散上限）
注：Zzk/Zzt分别反映器件在不同偏流下的动态特性，对稳压精度与负载变化响应有直接影响。
三、封装与热性能
器件为SOD-323小型表贴封装，尺寸紧凑、适合自动贴装与回流焊。最大耗散功率200 mW，按稳压15V计算，理论最大稳态电流约为0.2W/15V ≈ 13.3 mA；为保证温升与长期可靠性，建议工作电流常用范围控制在1–5 mA内，避免接近最大耗散功率区运行。
四、典型应用
- 低功耗参考电压源与偏置稳压
- 输入浪涌与直流钳位保护
- 模拟电路偏置、传感器供电稳压
- 通信与便携设备中的局部稳压模块
五、使用与设计注意事项
- 串联限流电阻：在使用中务必串联限流电阻以限制通过二极管的电流。示例：当输入24V且目标稳压15V，若期望Iz≈5 mA，则R=(24−15)/5 mA≈1.8 kΩ。
- 功耗裕度：考虑到封装散热限制与环境温度，应尽量留有安全裕度，避免长时间在Pd附近工作。
- 动态阻抗影响：在对稳压精度要求高的场合，需考虑Zzt对电压随电流变化的影响；低电流工作时Zzk较大，稳压可能出现较大偏差。
- 温度特性：稳压值随温度变化，具体温度系数请参考原厂详细datasheet，关键设计需进行温漂评估。
- 焊接与可靠性：遵循制造商回流焊曲线及防潮存储建议，避免过热或长时间高温暴露。
六、包装与保管建议
器件常见带装带盘（Tape & Reel），适合SMT贴装。存放时避免潮湿与高温，若长期存放建议使用干燥包装并按厂家MSL等级进行回流前烘烤处理。
结语：BZT52C15S以其小体积、低泄漏、适中的稳压等级，适合各种低功耗、空间受限的稳压与钳位场合。在电路设计中关注功耗限制与动态阻抗对稳压精度的影响，可保证长期稳定工作与可靠性。若需最高精度或更高功率，请参考厂方完整datasheet或选择更高功耗级别器件。
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