WMSIC Electronic Components

BORN BDFN2C031V

ModelBDFN2C031V
PackageDFN1006-2L
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BDFN2C031V
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BDFN2C031V
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.009g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
18pF
Electronic Component
BM0220683937
Operating Temperature
55℃~+125℃
Voltage
9V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BDFN2C031V

一、品牌介绍

BORN(伯恩半导体)是一家专注于半导体元器件设计和制造的知名企业,致力于为全球客户提供高性能、高可靠性的电子解决方案。公司产品涵盖电源管理、信号处理、射频、模拟电路等多个领域,在工业、消费电子、汽车电子等应用场景中均有广泛应用。

二、产品概述

BDFN2C031V是一款采用DFN1006-2封装的高效率电源管理芯片,设计用于满足现代电子设备对电源管理的需求。该产品通过集成多种功能,旨在提高系统性能,同时降低功耗,适用于各类便携式设备、智能家居产品及工业控制系统。

三、主要特性

  1. 高效能转换:BDFN2C031V采用先进的电源管理技术,具备高达90%以上的转换效率,能够在供电需求波动的情况下实现更好的电源利用率。

  2. 低静态电流:该芯片在待机模式下的静态电流极低,能够有效延长电池寿命,特别适合对待机功耗敏感的移动设备应用。

  3. 宽输入电压范围:BDFN2C031V支持宽输入电压范围(一般为3V到30V),使其能够兼容多种输入电源,方便与现有电源系统集成。

  4. 保护功能:内置的过流保护、过温保护和短路保护等功能,不仅提高了电源系统的稳定性,还确保了使用过程中的安全性,减少了因电源问题引发的设备故障的风险。

  5. 输出调节精度:其输出电压调节精度高达±2%,能够确保负载在不同工作条件下的供电稳定性,对敏感设备尤为重要。

  6. 小型封装:DFN1006-2封装形式有助于节省电路板空间,适应高密度布局的需求,同时简化中小型设备的设计难度。

四、应用场景

BDFN2C031V广泛应用于以下几个领域:

  1. 便携式电子设备:如智能手机、平板电脑、便携式音响等,需要高效能和低功耗的电源管理解决方案。

  2. 智能家居:在智能门锁、家庭自动化控制器等产品中,BDFN2C031V能够确保设备在长时间工作下的稳定性和可靠性。

  3. 工业控制模块:在工业自动化、传感器与控制系统中,电源管理芯片能保证系统在各种工况下的耐用性和稳定性。

  4. 汽车电子:在车载导航、娱乐系统中,BDFN2C031V提供稳定的电源供应,确保设备在复杂电磁环境下的正常运行。

五、总结

BDFN2C031V作为BORN(伯恩半导体)推出的一款高效电源管理芯片,以其卓越的转换效率、低功耗特性和丰富的保护功能,成为现代电子设计中颇具吸引力的选择。其适用范围广泛,既可满足个人消费领域的需求,也可在工业和汽车应用中提供可靠的电源解决方案。无论是在技术创新还是产品性能上,BDFN2C031V都将为客户的产品设计和开发提供有力支持。对于追求高效率和高可靠性的工程师与设计师来说,这是一个不容错过的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.