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BORN BAT54WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- BORN BAT54WS
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- BAT54WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0231019387
- Current
- 300mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 1V@100mA
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
- Surge Current (Ifsm)
- 600mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54WS 产品概述
一、主要参数
BAT54WS 为伯恩半导体（BORN）出品的一款肖特基二极管，封装 SOD-323。主要电气参数如下：正向压降 Vf = 1.0V @ 100mA；直流反向耐压 Vr = 30V；额定整流电流 If(AV) = 300mA；反向漏电流 Ir = 2µA @ 25V；非重复峰值浪涌电流 Ifsm = 600mA。该器件适合低压、低功耗及高速开关场合。
二、产品特性
- 低正向压降：在中小电流下具有较小的 Vf，有利于降低功耗和发热，提升电源效率。
- 低反向漏流：25V 条件下仅 2µA，可在待机或高阻抗信号路径中使用。
- 快速恢复速度：肖特基结构本征无少数载流子存储，适合高频整流与开关保护。
- 小型封装：SOD-323 占板面积小，适应空间受限的便携式与消费电子产品。
三、典型应用
- 低压整流与稳压后端的二次整流。
- 反向保护与反接保护电路（供电接口、充电电路）。
- 快速开关、混合信号接口的钳位与保护（例如 USB、传感器接口）。
- 便携设备、消费类电子、通信设备与汽车电子中的低功耗路径。
四、封装与热特性
SOD-323 小型塑料封装便于高密度贴装，但热阻相对较高。推荐在 PCB 设计中为器件提供短的散热路径以及必要的铜箔面积，以降低结温。工作环境下应留有裕度，避免长期在额定极限（如 300mA 连续）下运行。
五、设计注意事项
- 当电流接近 100mA 或更高时，应评估 Vf 带来的功耗：Pd ≈ I·Vf。
- 峰值浪涌电流 Ifsm 仅短时允许，避免频繁浪涌或长时间冲击。
- 对于高频整流，注意与电感、电容的配合，减少寄生振荡。
- 在 PCB 布局上，走线尽量短宽，靠近器件的大片铜区有助于散热与降低寄生电感。
六、替代型号及选型建议
可参考市场上常见的 BAT54 系列器件作为替代，选择时注意比较 Vr、If、Ir 及封装尺寸。若需更低 Vf 或更高 Vr，可考虑其他功率肖特基或 SBD（肖特基/快速恢复）方案。
七、采购与质量保证
选择正规渠道采购，关注批次资料与封装标识，必要时索取原厂或代理的检验报告与可靠性数据。对关键应用建议进行样片评估与温度应力测试，以确保长期稳定性与一致性。
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