WMSIC Electronic Components

BORN BDFN2C051U

ModelBDFN2C051U
PackageDFN1006-2
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BDFN2C051U
Type
BORN
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BDFN2C051U
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.005g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0231019400
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BDFN2C051U 产品概述

一、功能与定位

BDFN2C051U 为伯恩半导体(BORN)出品的单路双向ESD保护器件,面向高频信号线与接口端口的静电放电和浪涌防护需求。器件在小尺寸DFN1006-2封装下提供工业级水平的脉冲耐受能力,适配现代便携设备与通信接口的空间与性能要求。

二、主要电气参数

  • 钳位电压(Vc):15V(典型峰值钳位)
  • 击穿电压(Vbr):6V
  • 反向截止电压(Vrwm):5V
  • 峰值脉冲功率(Ppp):60W @ 8/20µs
  • 峰值脉冲电流(Ipp):3.5A
  • 反向漏电流(Ir):≤100nA
  • 结电容(Cj):0.5pF(低电容,适合高速信号)
  • 通道数:单路;极性:双向
  • 安规认证:满足 IEC 61000-4-2 / IEC 61000-4-4 / IEC 61000-4-5

三、产品特点

  • 低电容(0.5pF),对高速数据信号(USB、HDMI、LVDS等)影响小,保留信号完整性。
  • 双向保护,可直接用于信号双向通路或对称接口,免去额外偏置设计。
  • 高脉冲吸收能力(60W@8/20µs),能有效钳制短时浪涌与ESD事件。
  • 极低漏电(100nA),适合对功耗和精度敏感的模拟/传感器输入。
  • 紧凑DFN1006-2封装,便于节省PCB空间并实现SMT自动化组装。

四、典型应用场景

  • 智能手机与平板的外部接口防护(充电、耳机、数据口)
  • USB、HDMI、DisplayPort 等高速接口的端口保护
  • 传感器信号线、I/O 口、串行通信(UART、I2C)防护
  • 工业设备与仪器的抗干扰与浪涌保护

五、PCB布线与使用建议

  • 将器件靠近外部连线或接口位置布置,缩短受保护节点到器件的走线长度。
  • 将器件的参考端直接铺地平面并通过短、粗的过孔与底层地连接,以提升放电回路能力。
  • 避免在保护器与被保护信号之间串联大电阻或电感,保持低阻抗通路以保证快速钳位。
  • 对于多通道系统,注意各通道之间的隔离以免相互影响。

BDFN2C051U 以其低电容、高耐受和小封装特性,适合现代便携与高速通信产品的端口防护需求。选择时请根据系统最大工作电压与信号电平确认 Vrwm 与 Vbr 的匹配,并在实际布局中遵循最短接地回路与紧邻布置原则以获得最佳保护效果。

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