WMSIC Electronic Components

BORN BZT52C9V1S

ModelBZT52C9V1S
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52C9V1S
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52C9V1S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
100Ω
(Zzt)
15Ω
Electronic Component
BM0228561616
Diode
1
Current(Ir)
500nA
Power Dissipation(Pd)
200mW
Electronic Component
8.5V~9.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C9V1S — BORN(伯恩半导体) 小信号稳压二极管产品概述

一、产品简介

BZT52C9V1S 是 BORN(伯恩半导体) 推出的独立式稳压二极管,封装为 SOD-323,小型贴片设计,适用于空间受限的便携和消费类电子设备。标称稳压值 9.1V,稳压范围 8.5V ~ 9.6V,定位为低功耗、低漏电的微功率稳压与参考元件。

二、主要电气参数

  • 标称稳压值(Vz):9.1V(典型)
  • 稳压值范围:8.5V ~ 9.6V
  • 反向电流 Ir:500 nA @ 6V(低漏电,适合高阻抗回路)
  • 最大耗散功率 Pd:200 mW(器件热限,需注意散热与限流)
  • 稳压阻抗 Zzt:15 Ω(测试条件下的动态阻抗,反映负载变化时的稳压能力)
  • 静态/膝值阻抗 Zzk:100 Ω(表示在击穿开始区域的高阻抗特性)
  • 封装:SOD-323(超小型表面贴装)

以上参数为器件典型与最大额定值,实际使用应以厂商数据手册为准并预留安全裕量。

三、应用场景

  • 小功率基准电压源与偏置稳压(便携仪表、传感器前端)
  • 过压保护与电平钳位(信号线与接口保护)
  • 电路调试与模拟参考(低泄漏需求的高阻电路)
  • 消费电子与工业控制中对空间和成本敏感的稳压应用

四、使用建议与注意事项

  • 串联限流:作为齐纳稳压器使用时需在外部串联限流电阻以限制通过二极管的电流,避免超过 Pd。
  • 功耗计算:在最大耗散 200 mW 下,理论最大稳压电流 Iz_max ≈ 200 mW / 9.1 V ≈ 22 mA,但实际应按热阻与 PCB 散热条件降额使用。
  • 温度与散热:SOD-323 封装散热能力有限,推荐在 PCB 上设计适当铜箔面积并避免长时间接近最大功耗工作点。
  • 漏电影响:Ir 为 500 nA(@6V),在高阻抗测量或采样电路中仍可引入偏差,应结合电路设计评估影响。
  • 开机与瞬态:避免在无限流情况下直接给稳压二极管施加高电压或大瞬态电流,以防器件损坏。

五、封装与生产建议

SOD-323 适合回流焊装配,焊接时遵循常规温度曲线并控制焊接参数以防热损伤。放置与布线应尽量缩短与稳压点相关的回路路径,减少寄生阻抗对稳压精度的影响。

六、采购与型号信息

  • 型号:BZT52C9V1S
  • 品牌:BORN (伯恩半导体)
  • 封装:SOD-323

如需量产选型或更详细的热特性、测试条件与典型曲线,请参考官方数据手册或联系供应商获取样品评估。

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