WMSIC Electronic Components

BORN PESD5V0U1BL-N

ModelPESD5V0U1BL-N
PackageDFN1006-2
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN PESD5V0U1BL-N
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
PESD5V0U1BL-N
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.005g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
2.7pF
Electronic Component
BM0226526816
Voltage
12V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD5V0U1BL-N 产品概述

一、产品简介

PESD5V0U1BL-N 是 BORN(伯恩半导体)推出的一款单路、双向瞬态电压抑制(TVS)二极管,封装为 DFN1006-2。器件针对敏感信号线提供高效的静电放电(ESD)和电快速瞬变(EFT/浪涌)保护,符合 IEC 61000-4-2、IEC 61000-4-4 与 IEC 61000-4-5 等工业级抗扰度标准。

二、关键电气参数

  • 钳位电压(Clamping):12 V(在规定脉冲条件下)
  • 击穿电压(Vbr):约 5.5 V
  • 反向截止电压(Vrwm):5 V
  • 峰值脉冲功率(Ppp):40 W(8/20 μs)
  • 峰值脉冲电流(Ipp):3 A
  • 反向电流(Ir):≤100 nA
  • 结电容(Cj):典型 2.7 pF
  • 通道数:单路,极性:双向

以上参数表明该器件在保护 5 V 等级的信号和接口时,具有低漏电、低电容和较高的能量吸收能力,适合高速信号应用。

三、主要特性与优势

  • 低结电容(2.7 pF):对高速数据线影响小,适用于 USB、HDMI、I2C、SPI、串口等高速接口的保护。
  • 双向结构:可对双向电压过冲和反向极性的瞬态事件进行吸收,无需方向性区分,便于电路布局。
  • 小封装(DFN1006-2):占板面积小,适合空间受限的移动设备、消费电子和 IoT 终端。
  • 工业级浪涌与ESD等级:通过 IEC 61000 系列标准测试,可靠性高,适用于严苛电磁环境。

四、典型应用场景

  • 消费类电子:智能手机、平板、可穿戴设备的 I/O 接口保护
  • 通信设备:路由器、基站、调制解调器的信号线与控制线保护
  • 工业控制与仪表:对抗静电和脉冲干扰的敏感接口
  • 外围接口:USB2.0、UART、I2C、SPI 等高速数据线保护(注意工作电压不超过 Vrwm)

五、设计与使用建议

  • 保护方式:在被保护信号线与地之间并联放置,双向型无需考虑极性;如为差分对,可在每条线上并联一颗或选用差分 TVS 方案。
  • PCB 布局:近端放置于受保护器件的入口处,走线短且粗,保证导流回路阻抗最低;为提高吸能与散热性能,建议在地线处采用多层平面或加焊盘。
  • 功率与热管理:在连续或重复冲击场景下注意器件功耗与封装热阻,必要时通过外部阻尼或限流元件减少尖峰能量。
  • 工作电压限制:器件 Vrwm 为 5 V,禁止用于高于此电压的直流工作环境(如 12 V 总线)以避免触发或损坏。

六、封装与选型信息

  • 型号:PESD5V0U1BL-N
  • 品牌:BORN(伯恩半导体)
  • 封装:DFN1006-2(超小型 SMD 封装)
  • 适配:适合需要小体积、低电容且需满足 IEC 61000 系列抗扰度的设计场景

总结:PESD5V0U1BL-N 以其低电容、双向保护与良好的脉冲吸收能力,尤其适合 5 V 等级的高速接口与空间受限设备,是提升系统抗静电与抗浪涌能力的可靠选择。使用时请参照厂商封装尺寸与回流焊工艺建议以确保可靠焊接与热性能。

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