WMSIC Electronic Components

BORN TPD1E01B04DPYR-N

ModelTPD1E01B04DPYR-N
PackageDFN1006
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN TPD1E01B04DPYR-N
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
TPD1E01B04DPYR-N
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.007g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.3pF
Electronic Component
BM0230095882
Voltage
20V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPD1E01B04DPYR-N 产品概述

一、产品简介

TPD1E01B04DPYR-N 是 BORN(伯恩半导体)推出的一款单路双向低容抗干扰保护器件,采用紧凑 DFN1006 封装,专为对高速信号线和敏感接口提供触发式瞬态抑制(ESD/Surge/EFT)设计。器件在保持极低结电容(Cj = 0.3 pF)的同时,具备较高的脉冲承受能力(Ipp = 3.5 A @ 8/20 μs),能在不影响信号完整性的前提下,可靠地防止系统遭受静电放电和雷击脉冲破坏。

二、主要参数(关键规格)

  • 极性:双向(Bi-directional)
  • 反向截止电压 Vrwm:3 V(工作电压)
  • 击穿电压 Vbr:7.5 V
  • 钳位电压(典型):20 V
  • 峰值脉冲电流 Ipp:3.5 A @ 8/20 μs
  • 反向电流 Ir:100 nA(静态漏电小)
  • 结电容 Cj:0.3 pF(适合高速信号)
  • 通道数:单路
  • 封装:DFN1006(超小体积)
  • 标准兼容:IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)

三、核心优势

  • 极低结电容(0.3 pF):对高速差分或单端信号干扰极小,适合 USB、摄像头接口、时钟或其他高速数据线保护。
  • 双向保护:支持正负极性瞬态抑制,无需额外反向并联器件,便于保护双向信号或可反向驱动的接口。
  • 高脉冲承受能力:3.5 A(8/20 μs)能够应对常见的线路浪涌与雷击耦合事件,钳位电压 20 V 在保护下保持被保护节点安全。
  • 低漏流(100 nA):适合对静态功耗敏感的便携或电池供电终端。
  • 小型 DFN1006 封装:节省 PCB 空间,便于用于空间受限的移动设备或模块化设计。

四、典型应用场景

  • USB2.0/USB OTG、UART、I2C、SPI 等低压高速信号线保护
  • 摄像头接口、触控接口、音视频信号输入保护
  • 工业与消费类设备的接口防护(如前面板、传感器线缆等)
  • 需要满足 IEC 61000 系列抗扰度规范的系统端口保护

五、布局与使用建议

  • 器件应尽量靠近受保护的连接器或接口放置,降低走线环路感抗与感应耦合。
  • 将器件地端与大面积地平面直接连接,避免在器件与地之间走长距离或多层 via,减少地回路阻抗。
  • 对差分线或高速线建议保持最短走线,必要时与串联抑制电阻配合使用以改善共模抑制和限流能力。
  • DFN1006 小封装在焊盘设计时注意露铜与热沉铺设,保证焊接可靠性与散热路径。
  • 在高可靠性要求场合,可与串联阻抗、共模电感等滤波器件配合,形成多级保护方案。

六、选型参考

TPD1E01B04DPYR-N 适用于对工作电压约 3 V 且要求低容、高速信号完整性的保护场景。若系统工作电压更高或需要更高能量处理能力,可考虑选择更高 Vrwm 或更大 Ipp 的 TVS 器件;若更强调超低钳位,则需权衡击穿/钳位特性与信号兼容性。

总结:TPD1E01B04DPYR-N 以其低容、高速兼容性和规范级别的抗扰能力,适合在空间受限且对信号完整性有较高要求的接口防护设计中作为首选保护器件。

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