WMSIC Electronic Components

BORN BZT52C5V1T

ModelBZT52C5V1T
PackageSOD-523
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52C5V1T
Type
BORN
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52C5V1T
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.055g
Electronic Component
1
(Zzk)
480Ω
(Zzt)
60Ω
Electronic Component
BM0264682181
Diode
1
Current(Ir)
2uA
Power Dissipation(Pd)
200mW
Electronic Component
4.8V~5.4V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V1T稳压二极管产品概述

BZT52C5V1T是伯恩半导体(BORN)推出的一款小型表面贴装稳压二极管,专为低功耗、高密度电子设计场景打造,核心功能是提供稳定的5.1V参考电压,广泛适配便携设备、小型电源等领域。

一、产品基本定位与品牌背景

该器件属于伯恩半导体稳压管系列中的通用低功率型号,伯恩半导体作为国内功率器件领域的成熟厂商,其产品以一致性好、可靠性高著称。BZT52C5V1T继承了品牌的稳定特性,针对小空间、低功耗需求优化,是5V系统稳压的高性价比选择。

二、核心电参数深度解析

1. 稳压值与精度

标称稳压值为5.1V,实际工作范围覆盖4.8V~5.4V,精度约±6%,满足多数通用电路的稳压需求(如5V电源的辅助稳压、传感器参考电压)。该参数在指定测试电流下测得,批量产品一致性良好。

2. 耗散功率与电流限制

最大耗散功率(Pd)为200mW,属于小功率稳压器件。结合标称稳压值计算,最大允许连续工作电流约39mA(I=Pd/Vz≈200mW/5.1V),适合小电流稳压或过压保护,不推荐大功率负载应用。

3. 动态阻抗特性

  • Zzt(测试电流下动态阻抗):60Ω,反映稳压管在额定电流下的电压稳定性,阻抗越低,输出电压受电流波动的影响越小;
  • Zzk(反向击穿电流下动态阻抗):480Ω,对应击穿初期的阻抗特性,说明器件在击穿状态下仍能维持基本稳压能力。

4. 反向漏电流

反向漏电流(Ir)仅2uA,远低于常规稳压管水平,这一特性使其在低功耗场景(如物联网终端、电池供电设备)中表现优异,可有效降低待机功耗。

三、封装形式与物理特性

BZT52C5V1T采用SOD-523封装,这是一种超小型表面贴装封装,具体尺寸为:

  • 长度:1.6±0.1mm;
  • 宽度:0.8±0.1mm;
  • 高度:0.8±0.1mm;
  • 引脚间距:0.65±0.1mm。

该封装的核心优势:

  1. 节省PCB空间,适配高密度设计;
  2. 支持自动化贴装,提升生产效率;
  3. 重量轻(约0.01g),满足便携设备轻量化需求。

封装带色带标识负极,安装时需注意极性(色带端接电路正极),反向接入会导致器件短路烧毁。

四、典型应用场景

  1. 便携电子设备:智能手机、智能手环、蓝牙耳机等,用于辅助稳压或过压保护,维持核心电路电压稳定;
  2. 小型电源模块:5V输出的微型电源中,作为稳压参考或过压防护元件,提升电源可靠性;
  3. 传感器电路:为温度、湿度传感器提供稳定5V参考电压,保证输出精度;
  4. 低功耗物联网终端:智能门锁、环境监测节点等,利用低漏电流特性降低待机功耗,延长电池寿命。

五、应用注意事项

  1. 电流限制:连续工作电流不宜超过39mA,若需更大电流,需并联多个器件或选择更高功率型号;
  2. 散热设计:虽Pd较小,但密集贴装场景需预留散热空间,避免局部过热;
  3. 极性识别:SOD-523封装色带端为负极,安装时需正确对接;
  4. 测试条件:电参数需在 datasheet 指定条件下验证(如Zzt测试电流通常为1mA),实际应用需保证工作电流在合理区间。

六、选型替代参考

  • 同参数同封装:伯恩同系列BZT52C5V0(5.0V)、BZT52C5V2(5.2V);
  • 更高功率:BZT55C5V1(SOD-123封装,Pd=500mW),适配更大电流需求;
  • 进口替代:NXP BZT52C5V1(参数接近,性价比略低)。

总结,BZT52C5V1T凭借小封装、低漏电流、稳定稳压特性,成为便携电子、低功耗电路中5V稳压的理想选择,适合对空间和功耗敏感的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.