WMSIC Electronic Components

BORN UCLAMP0571P-N

ModelUCLAMP0571P-N
PackageDFN1610
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN UCLAMP0571P-N
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
UCLAMP0571P-N
Electronic Component
1
Package
DFN1610
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.04g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
550pF
Electronic Component
BM0264602942
Voltage
19V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UCLAMP0571P-N 产品概述

一、产品简介

UCLAMP0571P-N 是 BORN(伯恩半导体)推出的一款单路、单向瞬态电压抑制器(ESD 保护器件),采用固态硅雪崩技术。器件采用微型 DFN1610 封装,专为手机与配件、基于微处理器的便携式设备等空间受限、对静电与浪涌保护有较高要求的应用场景设计。器件通过 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 标准认证,兼顾高能量吸收能力与低泄漏特性。

二、主要电气参数(典型)

  • 极性:单向(正向对地保护)
  • 反向截止电压 Vrwm:7 V
  • 击穿电压 VBR(测量条件):7.2 V
  • 钳位电压 Vc(峰值):19 V
  • 峰值脉冲电流 Ipp:75 A(8/20 μs 波形)
  • 峰值脉冲功率 Ppp:1.5 kW(1500 W,8/20 μs)
  • 反向泄漏电流 Ir:100 nA(典型/最大)
  • 结电容 Cj:550 pF
  • 通道数:单路
  • 类型:ESD / 浪涌保护
  • 技术:固态硅雪崩(SAV)
  • 认证防护等级:符合 IEC 61000-4-2 / 4-4 / 4-5

以上参数表明器件在面对高能量脉冲(如 8/20 μs 浪涌)时具有良好的能量吸收与钳位性能,同时保持很低的静态漏电,适合对功耗与信号完整性要求较高的移动电子产品。

三、封装与机械特性

  • 封装:DFN1610(超小型微型封装)
  • 封装优势:占板面积小、引线电感低、便于靠近被保护节点布板,利于降低钳位电压与提升响应速度。

DFN1610 的尺寸与低电感特性使得 UCLAMP0571P-N 可直接贴近接口或敏感节点放置,实现更有效的瞬态能量引导至接地。

四、典型应用场景

  • 手机与移动配件(充电口、数据口、耳机接口等)
  • 基于微处理器的便携式设备(控制、通信接口保护)
  • USB/串口/I/O 端口瞬态浪涌与静电保护
  • 工业小型模块、穿戴设备等对空间与性能有双重要求的场合

其 7 V 的 Vrwm 与 550 pF 的电容值适合用在 3.3 V/5 V 等电压等级的数据或电源线上,兼顾保护能力与信号完整性。

五、应用建议与布局注意事项

  • 尽量将器件靠近需保护的连接器或输入端放置,缩短到接地平面的回流路径。
  • 保持器件对地的低阻抗、低电感连接,采用较宽的地铜箔与适当的接地过孔以分散能量。
  • 对高速信号线使用时注意结电容(550 pF)对信号带宽的影响,必要时配合串联阻抗或滤波电路优化信号完整性。
  • 在电源线上使用时,若系统存在较高工作电压,应确认 Vrwm 与系统最大工作电压匹配,防止误导通。
  • 对于重复或高能量冲击场景,可配合串联限流元件或多级保护方案提高系统可靠性。

六、包装与选型提示

  • 品牌:BORN(伯恩半导体)
  • 型号示例:UCLAMP0571P-N(DFN1610,单路单向)
  • 选型时请核对 Vrwm、Vc 与系统工作电压、结电容对信号影响以及浪涌能量等级是否满足应用要求。

总结:UCLAMP0571P-N 以其 1.5 kW 峰值脉冲功率、低钳位电压、低泄漏电流与微型 DFN1610 封装,为移动终端与微处理器设备提供紧凑且高效的瞬态保护解决方案。在实际设计中合理布板并结合系统需求选型,可显著提升端口与器件的抗静电与抗浪涌能力。

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