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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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1SMA4744A 为 BORN(伯恩半导体)推出的 SMA(DO-214AC)封装贴片稳压管,标称稳压值 15V,单只独立封装,额定耗散功率 1W。器件适合用于中低功率的基准稳压、过压保护及浪涌吸收场合,兼顾贴片工艺与热管理需求。
Zener 15V 在工作区表现为较稳定的基准电压;Zzt=14 Ω 表示在指定测试点下的动态阻抗偏小,有利于负载变化时维持电压稳定;Zzk=700 Ω 反映出在击穿膝部的非线性特性,对输入电流突变时的响应影响较大。Ir=5 µA 表明低压差下漏电小,适合对静态功耗敏感的电路。
根据 Pd=1W 与 Vz=15V,可估算最大稳态分流电流 Iz(max) ≈ 1W / 15V ≈ 66.7 mA,实际设计应留有裕量,推荐工作电流远低于该值以降低发热和提升可靠性。
使用示例:在做并联稳压时,给定输入 Vin 与负载,需通过串联限流电阻 R = (Vin - 15V) / Iz 计算合适阻值,并保证 Iz 与 Iz(max) 的安全距离。
SMA 封装为贴片形式,推荐依据厂商封装图采用相应的 PCB 焊盘布局。1W 功耗级别下需考虑 PCB 铜箔面积与热散布,多采用增加焊盘面积、下层过孔或加大铜厚以降低结-环境热阻。回流焊工艺请遵循无铅温度曲线,避免超温与长时间高温应力。
器件型号:1SMA4744A,品牌:BORN(伯恩半导体),封装:SMA (DO-214AC)。采购时注意查验批次、管脚标记和静电防护要求,并按应用场景对筛选样品进行温升与长期老化测试以确认稳定性。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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