WMSIC Electronic Components

BORN BSD9C051V

ModelBSD9C051V
PackageSOD-923
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSD9C051V
Type
BORN
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSD9C051V
Electronic Component
1
Package
SOD-923
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
15pF
Electronic Component
BM0258880909
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD9C051V(BORN 伯恩)——5V 单路 TVS 静电/浪涌保护器件概述

一、概述与定位

BSD9C051V 为 BORN(伯恩半导体)出品的一款单通道 TVS(二极管型瞬态抑制器),封装为 SOD-923,专为 5V 电源与 I/O 接口的静电(ESD)与脉冲浪涌(浪涌/EFT)保护设计。器件在常见工业与消费类产品中用于保护敏感芯片免受瞬态过压损坏,兼顾小封装占板空间小的需求。

二、主要电气参数(典型/标称)

  • 反向截止电压 Vrwm:5 V(适配 5V 系统)
  • 击穿电压:6 V(典型)
  • 钳位电压 Vc(峰值):15 V(8/20 μs 波形,5A)
  • 峰值脉冲电流 Ipp:5 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:100 W @ 8/20 μs
  • 反向漏电流 Ir:1 μA(常温)
  • 结电容 Cj:15 pF(对高速信号有一定影响)
  • 通道数:单路;封装:SOD-923
  • 防护等级:满足 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)标准

三、特点与优势

  • 小封装(SOD-923),适合空间受限的移动设备、便携式终端与主板边缘保护。
  • 低静态漏电(1 μA),对电池供电与低功耗系统友好。
  • 中等结电容(15 pF),兼容多数低速/中速数据线(如 USB2.0、UART),但对超高速接口(如 USB3.x、PCIe)需评估。
  • 钳位性能良好(15 V@5A),能有效限制瞬态电压以保护下游器件。
  • 符合 IEC 61000-4-2/4-4,便于系统通过抗干扰与抗静电测试。

四、典型应用场景与选型建议

  • 适用场景:USB 5V VBUS 保护、单片机 I/O 口、通信接口(UART、I2C、SPI)端口保护、电源轨防护(5V)及外壳接地附近保护。
  • 选型建议:若保护对象为电源轨(单向浪涌),BSD9C051V 的 5 V Vrwm 非常合适;若需在差分或双向信号线上保护(无参考地方向切换),需确认器件为双向型或选择对应双向 TVS。
  • 对高速信号:15 pF 结电容对 USB2.0 等多数应用可接受,但对 1 Gbit/s 以上链路可能影响信号完整性,应进行仿真或选择低电容型号。

五、布局与可靠性建议

  • 放置位置:尽量靠近被保护的接口或引脚(推荐 1–2 mm 以内),缩短走线以降低感性耦合。
  • 接地处理:为获得最佳放电路径,保证 TVS 的 GND 引脚具有低阻抗回流路径,局部地铜厚、短接地回路、减少 Vias。
  • 热与重复冲击:Ppp 与 Ipp 表示瞬态能力,器件可承受单次或有限次数的高能脉冲;不适合代替浪涌抑制器用于持续性过压,必要时并联熔断器或限流元件以提高可靠性。
  • 贴片工艺:遵循制造商推荐的回流焊温度曲线与焊盘设计,避免机械应力影响封装可靠性。

总结:BSD9C051V 是一款面向 5V 系统的单路 TVS,具有小体积、低漏电与良好瞬态吸收能力,适合用于 USB、电源轨与一般 I/O 端口的 ESD/浪涌保护。在实际设计中请根据是否需要双向保护、对信号完整性的要求及冲击能力(Ppp/Ipp)进行验证;更多极限参数与典型曲线请参考原厂数据手册或联系供应商获取完整测试条件与认证级别。

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