Model & package intelligence
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BORN BAS70-04
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BAS70-04
- Type
- BORN
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BAS70-04
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0231019388
- Current
- 70mA
- Diode
- 1
- Current(Ir)
- 100nA@50V
- (Vf)
- 1V@15mA
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS70-04 产品概述
一、概述
BAS70-04 是伯恩半导体（BORN）推出的一款肖特基二极管，采用 SOT-23 小型封装，针对低压差、高速开关及低泄漏场合设计。其正向压降低、反向泄漏小，适合用于便携式与工业电子的保护与整流应用。
二、主要特性
- 正向压降（Vf）：约 1.0V @ If = 15mA，低压降有利于减少功耗和发热。
- 直流反向耐压（Vr）：70V，适用于中低压反向阻断。
- 直流整流电流（If，连续）：70mA，满足小电流整流需求。
- 反向电流（Ir）：100nA @ 50V，低泄漏有利于高阻态保持与低静态功耗。
- 非重复峰值浪涌电流（Ifsm）：100mA，可承受短时浪涌冲击。
- 工作结温范围：-40°C ~ +125°C，适合广泛温度环境。
三、电气性能说明（基于典型条件）
上述参数为器件在典型测试条件下的性能参考。正向压降会随工作电流和结温变化而上升，反向漏电随温度显著增加；如在高温或高压工况下使用，应考虑泄漏与发热的影响并做相应降额设计。
四、封装与机械信息
BAS70-04 采用 SOT-23 小体积封装，便于表面贴装（SMT）工艺，适合空间受限的 PCB 布局。封装利于自动贴装与回流焊接。建议按厂商回流焊温升曲线和 PCB 热设计规范进行装配以保证可靠性。
五、典型应用
- 低压整流与检测电路
- 反向电源保护与电源选择（OR-ing）
- 高速开关与信号钳位
- 便携设备、移动终端及物联网模块的省电电路
- RC/DC 电源及隔离前端的小电流整流
六、设计与可靠性建议
- 在高温环境或接近极限电压时应适当降额使用，控制结温上升以抑制反向泄漏。
- 若需长期承受浪涌或脉冲电流，建议评估 Ifsm 与 PCB 散热能力，或选用额定更高的型号。
- 做好 ESD 管理与静电防护，贴片器件在搬运和贴装过程中应防静电。
- 推荐在设计评估阶段进行实际电流/温度下的功耗与热仿真。
七、选型与采购注意事项
在基于 BAS70-04 选型时，确认实际工作电流、最大反向电压及允许的浪涌水平是否满足应用需求。如需更低正向压降或更高电流能力，可考虑其它封装或型号。采购时注意向供应商确认品牌、批次与出货文件以保证质量与可追溯性。
如需器件完整数据手册（Datasheet）、典型波形或封装尺寸图，请提供联系方式或要求，我可进一步整理详尽资料。
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