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BORN BPESD0402-140
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BPESD0402-140
- Type
- BORN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BPESD0402-140
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.014g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.15pF
- Electronic Component
- BM0226526782
- Voltage
- 40V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 200nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BPESD0402-140 产品概述
一、产品简介
BPESD0402-140 是 BORN（伯恩半导体）推出的一款高可靠性表面贴装单通道双向 ESD 保护器件，封装规格为 0402。该器件针对敏感信号线提供瞬态过压防护，满足 IEC 61000-4-2 静电放电防护要求，在保持极低结电容（Cj = 0.15 pF）的同时提供有效的钳位，适合高速接口和空间受限电路板使用。
二、主要参数与特性
- 钳位电压：40 V（典型钳位水平，提供有效限压保护）
- 反向截止电压 Vrwm：14 V（工作电压上限，器件在此电压下保持高阻态）
- 反向泄漏电流 Ir：200 nA（在 Vrwm 下的典型漏电）
- 结电容 Cj：0.15 pF（极低电容，适合高速差分或单端信号）
- 通道：单路，极性：双向（对正负极对称钳位）
- 防护等级：符合 IEC 61000-4-2 标准
- 封装：0402 SMD，适合高密度布局
三、典型应用场景
- 智能手机、平板、可穿戴设备等移动终端的高速接口防护（如 MIPI、USB、串行差分对）
- 工业控制与传感器接口中对静电冲击敏感的信号线保护
- 耳机插孔、按键线、外设连接器等有限空间处的本地防护
四、PCB 布局与使用建议
- 尽量将器件放置在靠近保护对象（如连接器或芯片引脚）的位置，以缩短回路路径，提升保护效果。
- 对差分对应用，可将双向器件并联在差分对两端或根据系统接地方式进行线对线钳位。
- 采用短且宽的接地回流路径，若条件允许可在附近设置多条地通过孔以降低回路阻抗。
- 推荐遵循标准回流焊工艺，0402 封装需注意贴装精度与焊膏量控制。
五、可靠性与注意事项
- 器件在规定工作电压（≤ Vrwm）下应保持低泄漏并长期稳定；过压或大能量冲击后建议评估器件是否需更换。
- 存储与装配过程中应遵守静电防护规范，避免在非受控环境下直接接触器件引脚。
- 在高能量瞬态（例如高电压雷击或反复大电流冲击）应用中，应结合其它保护元件（如熔断器、阻尼网络）构成完整保护方案。
如需获取器件封装尺寸图、典型 V-I 曲线或具体应用参考电路图，可联系供应商或查阅 BPESD0402-140 的详细规格书以进行深入设计验证。
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