WMSIC Electronic Components

BORN BZT52B8V2S

ModelBZT52B8V2S
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52B8V2S
Type
BORN
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52B8V2S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
15Ω
Electronic Component
BM0264682171
Diode
1
Current(Ir)
700nA
Power Dissipation(Pd)
200mW
Electronic Component
8.04V~8.36V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B8V2S — BORN(伯恩) 8.2V 稳压二极管(SOD-323)产品概述

一、产品简介

BZT52B8V2S 是 BORN(伯恩半导体)推出的一款小功率稳压二极管,标称稳压值 8.2V,稳压值范围 8.04V ~ 8.36V,封装为 SOD-323 小型表面贴装封装。该器件适用于体积受限、低功耗的稳压参考与浪涌/钳位保护场合,具有低反向漏电和较好的动态阻抗特性。

二、主要电气参数

  • 标称稳压 Vz:8.2V(范围 8.04V ~ 8.36V)
  • 反向漏电 Ir:700 nA(在 5V 测试条件下)
  • 最大耗散功率 Pd:200 mW(环境温度 25°C 时典型器件极限)
  • 动态阻抗 Zzt:15 Ω(在测试条件下,表示稳压区的交流阻抗)
  • 膝部阻抗 Zzk:80 Ω(反向启动区的阻抗特性)
  • 封装:SOD-323(小型贴片,适合高密度 PCB)

三、器件特点与设计意义

  • 小体积:SOD-323 封装便于高密度贴片组装,适合便携与空间受限设备。
  • 低漏电:Ir 700 nA 表明在偏低电压下的漏电流非常小,有利于低功耗与高阻电路的参考稳定性。
  • 良好稳压特性:Zzt 值较低,稳压时交流成分抑制良好,适合作为微弱信号电路的参考源。
  • 适中功率能力:200 mW 的耗散能力适合用于小电流旁路/基准电路,必要时需关注散热与功率限制。

四、典型应用场景

  • 低功耗电源参考与基准(如传感器供电基准、电平参考)
  • 输入浪涌或过压钳位保护(对敏感输入端进行限压)
  • 偏置与电平移位电路(在模拟前端或放大器偏置中)
  • 便携式终端、物联网节点、仪表等对体积和功耗有严格要求的设备

五、使用注意与设计建议

  • 功率与电流计算:最大直流电流近似由 Pd / Vz 给出,即 Imax ≈ 200 mW / 8.2 V ≈ 24 mA。为保证长期可靠性和温升余量,实际工作电流建议远低于该值(例如数毫安或更低),并考虑环境温度的降额。
  • 偏置电阻设计举例:若输入 12V,希望稳压 8.2V,选定稳压电流 Iz = 5 mA,则限流电阻 R = (12 − 8.2) / 5 mA ≈ 760 Ω;此时二极管功耗约 41 mW,远低于 Pd。
  • 动态阻抗影响:Zzt = 15 Ω 表明在稳压区有一定输出阻抗,若对输出噪声/精度敏感,可适当提高偏置电流以降低交流噪声或选用滤波网络。
  • 散热与降额:Pd 为在特定温度下的极限值,实际 PCB 热阻、环境温度会影响最大允许耗散,建议在高温环境降额使用并在 PCB 设计中提供良好散热路径(如铜箔加宽)。

六、封装与装配提示

SOD-323 为常见小型贴装封装,适合回流焊工艺。装配时按厂商推荐的 PCB 焊盘尺寸与回流曲线执行,避免长时间过高温度。使用前应参考制造商的完整规格书以确认焊接条件与存储抗潮湿等级。

七、选型与采购要点

在选型时确认稳压精度、漏电和功耗是否符合系统需求;若需要更高功率或更低动态阻抗,可考虑更大封装或不同系列。购买时留意品牌与批次信息,确保与设计参数一致。

总结:BZT52B8V2S 以其 8.2V 稳压值、低漏电和 SOD-323 小形封装,适合对体积、功耗和成本有要求的稳压参考与保护应用。在设计时应结合偏置电流、功耗和散热条件合理选用,以确保长期稳定运行。

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