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BORN SMD1206-035/30N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD1206-035 / 30N
- Type
- BORN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD1206-035/30N
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0258880918
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 600mW
- Current(Imax)
- 100A
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD1206-035/30N 产品概述
一、产品简介
SMD1206-035/30N 是 BORN（伯恩半导体）推出的一款表面贴装熔断器（1206 封装），用于对低压直流/交流电路提供过流保护。器件体积小、响应快速，适合对 PCB 空间和成本有严格要求的消费电子、通信设备和工业控制场合。
二、主要参数
- 额定耐压（Vmax）：30 V
- 允许最大浪涌电流（Imax）：100 A（脉冲能力）
- 保持电流（Ihold）：350 mA（最大持续工作电流）
- 跳闸电流（Itrip）：700 mA（典型动作点）
- 功耗/热散限制（Pd）：600 mW
- 初始态电阻（Rmin）：300 mΩ（典型低阻）
- 跳断后最大残留电阻（R1max）：1.4 Ω（开路可靠性）
- 动作时间：约 100 ms
- 工作温度范围：-40 ℃ ～ +85 ℃
- 封装：1206 SMD（适用于自动贴装与回流焊）
三、特性与优势
- 小型化封装便于高密度 PCB 布局；适配常用 1206 焊盘设计。
- 明确的保持/跳闸电流特性，能在正常工作电流下稳定通过，而在短路或异常突变电流下快速动作保护设备。
- 低初始电阻带来较小的压降与功耗，符合电源敏感电路需求；跳断后残留电阻足以限制故障电流。
- 优良的热稳定性与宽温工作范围，适用于温变条件复杂的产品。
四、典型应用场景
- 手机配件、小型电源模块、充电电路的输入保护。
- 工业传感器与控制模块的线路过流保护。
- 通信设备、IoT 终端与便携式设备的电源管理保护段。
五、使用建议与注意事项
- 连续工作电流应低于 Ihold（350 mA），并考虑环境温度和周边热源的叠加影响，必要时进行降额设计。
- 对于存在较大浪涌（如电机启动、灯负载）的场合，需验证 Imax 与动作时间是否满足防护要求，或选用更高脉冲能力产品。
- 建议将熔断器尽量靠近电源输入端放置以缩短故障回路并提升保护效果。
- 回流焊工艺需遵循厂商焊接温度曲线，避免超温或长期热应力影响可靠性。
- 跳断后应更换器件，勿尝试维修或短接以避免安全风险。
六、封装及选型提示
SMD1206-035/30N 为标准 1206 封装，兼容常规 1206 PCB 焊盘。选型时应综合考虑最大允许电压（30 V）、持续与冲击电流能力、响应时间与功耗限制，结合实际负载特性与环境条件进行评估。如需更高电压或更大保持电流，请参考同系列或更高规格的产品型号。
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