WMSIC Electronic Components

BORN BEP0080TB

ModelBEP0080TB
PackageSMA
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BEP0080TB
Type
BORN
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BEP0080TB
Electronic Component
1
Package
SMA
Electronic Component
Thyristor Surge Suppressor (TSS)
Electronic Component
0.543g
Current
5uA
Electronic Component
1
Electronic Component
BM0229259069
Operating Temperature
40℃~+150℃
Latching Current(Ih)
50mA
Switch Voltage(Vs)
25V
Capacitor(Co)
32pF
Voltage(Vt)
4V
Current(It)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BEP0080TB 产品概述

一、产品概述

BEP0080TB 是 BORN(伯恩半导体)出品的一款表面贴装放电管(SMA 封装),用于瞬态过压、雷击和浪涌保护。该器件设计用于在异常过压时迅速导通,将高能脉冲导向地或回路线,从而保护下游敏感电子元件和接口电路。器件适用于通信端口、信号线、供电线及各类电子模块的浪涌防护场合。

二、主要电气参数

  • 断态峰值电压(Vdrm):6 V(器件在断态下可承受的最大峰值电压)
  • 开关电压(Vs):25 V(触发导通所需电压)
  • 通态电压(Vt):4 V(导通时的压降)
  • 通态电流(It):2.2 A(连续导通电流或额定工作电流)
  • 峰值脉冲电流(Ipp):80 A(短时冲击能力,单位脉冲能量高时的峰值)
  • 漏电流:5 μA(断态下的微小泄漏电流)
  • 保持电流(Ih):50 mA(维持导通所需的最小电流)
  • 断态电容(Co):100 pF(断态下对高速信号的影响)
  • 工作温度范围:-40℃ 至 +150℃

以上参数为器件在典型条件下的电特性,实际应用时请参照详细规格书进行温度和波形的修正。

三、功能特点与优势

  • 高浪涌承受能力:Ipp 高达 80 A,能有效吸收短时大电流冲击。
  • 低断态漏流:5 μA 的低漏电流有助于低功耗和高灵敏度应用。
  • 快速响应:从断态到导通电阻急剧下降,能在过压瞬间有效夹紧电压。
  • 小体积封装:SMA 表面贴装,便于自动化贴装与高密度 PCB 设计。
  • 宽温度范围:-40℃~+150℃,适应恶劣环境及工业级应用。

四、典型应用场景

  • 通信端口保护:例如以太网、串口、光模块供电线的浪涌抑制。
  • 电源输入防护:开关电源、电池输入的反向或瞬态防护。
  • 工业控制设备:PLC、传感器接口等易受浪涌影响的场合。
  • 消费类电子及车载电子:需根据工作温度与汽车规范做额外验证。

五、封装与安装建议

  • 封装:SMA(小型表贴,适合自动化回流焊工艺)。
  • 布局建议:放电管应尽量靠近被保护端口或外部接入点放置,走线尽可能短且宽,以降低串联电感和接触电阻。接地端采用低阻抗的大面积接地平面,并确保返回路径短且直接。
  • 焊接:兼容标准回流焊温度曲线,焊接工艺需参考厂商焊接说明以避免过热损伤器件。

六、选型与使用注意事项

  • 匹配工作电压:Vdrm(6 V)表明器件断态下的最大承受电压,应确保正常工作电压远低于该值或选择合适的器件规格。
  • 触发门槛与被保护电路:Vs(25 V)与 Vt(4 V)决定触发与钳位行为,确认触发不会影响正常信号或导致误触发。
  • 能量与次数:虽然 Ipp 能承受高峰值冲击,但重复冲击或高能量冲击会累积损伤,必要时并联冗余或配合慢熔断器、限流元件使用。
  • 温度与寿命:高温环境会降低器件耐受能力,应根据工作温度进行适当降额设计。

七、可靠性与维护建议

  • 在实际系统中进行浪涌测试(例如符合行业脉冲波形)以验证保护效果。
  • 对关键应用建议做长期温度循环与冲击试验,评估在实际环境下的可靠性。
  • 对于频繁遭受冲击的应用,考虑定期检测或更换策略,以保证持续保护可靠性。

总结:BEP0080TB 以其高脉冲吸收能力、低漏电流和小型 SMA 封装,适合多类接口与电源线的浪涌保护。正确选型与合理的 PCB 布局、热管理以及配合限制电流措施,能有效延长被保护电路的使用寿命并提升系统可靠性。若需更详细的电气曲线、浪涌波形响应或封装尺寸,请提供规格书索取或联系厂商技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.