WMSIC Electronic Components

BORN 0603ESDA-09N

Model0603ESDA-09N
Package0603
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 0603ESDA-09N
Type
BORN
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
0603ESDA-09N
Electronic Component
1
Package
0603
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.039g
Electronic Component
1
Cj- Capacitor
1.5pF
Electronic Component
BM0229259079
Operating Temperature
55℃~+125℃
Voltage
100V
Electronic Component
IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603ESDA-09N 产品概述

一、产品概述

0603ESDA-09N 是伯恩半导体(BORN)推出的一款微型双向ESD器件,封装为0603,专为对线路进行瞬态静电放电保护而设计。器件极性为双向,工作电压(Vrwm)为9V,能在低电压应用中提供可靠的浪涌抑制,同时保持极低的结电容(Cj = 1.5 pF),适合高速信号线保护。设备工作温度范围宽,-55℃至+125℃,并满足 IEC 61000-4-2 静电放电防护要求。

二、主要电气参数

  • 极性:双向(bidirectional),可双向钳位ESD脉冲
  • 反向截止电压(Vrwm):9 V,适合 5V 及以下供电环境的直连保护
  • 钳位电压:100 V(典型),在遭受瞬态冲击时对线路进行电压限幅
  • 反向电流(Ir):500 nA(在 Vrwm 条件下),漏电小,适用于低功耗电路
  • 结电容(Cj):1.5 pF,低电容特性对差分与高速单端信号干扰小
  • 工作温度:-55℃ ~ +125℃
  • 防护等级:符合 IEC 61000-4-2 静电放电测试规范

三、关键特性与优势

  • 体积小:0603 封装占板面积极小,适用于空间受限的移动设备和精密终端
  • 低电容:1.5 pF 的结电容对高速数据线(如 USB、Audio、串行接口等)影响极小,能在保护与信号完整性间取得平衡
  • 双向保护:无需区分极性,可同时抑制正负极性的静电脉冲,简化设计与备件管理
  • 宽温工作:适应工业和消费级环境的温度要求,可靠性高
  • 低漏电:500 nA 的反向电流保证在待机或低功耗模式下不会显著增加系统功耗
  • 符合国际标准:通过 IEC 61000-4-2 测试要求,提升产品抗静电干扰能力

四、典型应用场景

  • 手机与可穿戴设备的接口防护(按键、音频接口、充电口)
  • 高速数据传输线保护(USB、UART、SATA 前端等,需注意速率与容限)
  • 工业控制终端、智能家居模块的外部I/O保护
  • 摄像头模块、传感器模组等对体积和电容敏感的输入端保护

五、封装与可靠性

0603 封装支持标准贴片回流焊工艺,推荐在靠近被保护引脚与接地回流点处贴装,以降低钳位回路的感抗和提升瞬态吸收性能。器件在典型的 PCB 布局中应确保有良好的接地路径,必要时配合地平面或旁路元件优化放电路径。本产品适应工业级温度循环与湿热条件,可靠性经过常规环境和电气应力验证。

六、选型与使用建议

  • 若被保护信号为高速差分或对电容非常敏感,0603ESDA-09N 的 1.5 pF 特性是优选;若对钳位电压有更严格要求,可考虑更低钳位级别的型号。
  • 布局时应尽量缩短器件到被保护管脚与地的走线长度,以降低寄生电感带来的峰值电压升高。
  • 在高能量或重复浪涌环境中,评估是否需要并联更高能量吸收元件或增加串联阻抗以保护该器件。
  • 验证器件在目标系统下的实际钳位表现,必要时在样机上进行 IEC 61000-4-2 及系统级抗扰度测试。

0603ESDA-09N 以其微型封装、低电容与双向保护特性,为对空间和信号完整性有严格要求的电子产品提供了一种经济且有效的静电防护方案。若需器件外形尺寸、焊盘建议或更详细的电气测试曲线,可提供进一步资料或样品测试支持。

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