WMSIC Electronic Components

BORN SMFJ64A

ModelSMFJ64A
PackageSOD-123FL
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ64A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMFJ64A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0257674540
Operating Temperature
55℃~+150℃
Voltage
103V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
71.1V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ64A 产品概述

一、概述

SMFJ64A 是伯恩半导体(BORN)推出的一款单向瞬态抑制二极管(TVS),用于对抗浪涌、电快速瞬变和静电放电等瞬态过电压事件。器件以 SOD-123FL 小型封装提供,适用于空间受限的电路板设计,在工业、通信、电源及汽车电子等领域提供可靠的浪涌防护。

二、关键参数

  • 极性:单向(单极 TVS)
  • 反向截止电压 Vrwm:64 V
  • 击穿电压(典型):71.1 V
  • 钳位电压(Ipp 下):103 V
  • 峰值脉冲电流 Ipp:1.7 A(10/1000 μs 波形)
  • 峰值脉冲功率 Ppp:200 W(10/1000 μs)
  • 反向电流 Ir:1 μA(在 Vrwm 条件下)
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 防护等级 / 兼容性:满足 IEC 61000-4-4(EFT)与 IEC 61000-4-2(ESD)测试要求
  • 封装:SOD-123FL(表面贴装)

三、特性与优势

  • 高能量吸收能力:在 10/1000 μs 波形下可承受 200 W 峰值功率,可处理常见的浪涌脉冲。
  • 低钳位电压:在指定脉冲电流下钳位电压约 103 V,有利于保护被保护电路不受高压尖峰损害。
  • 低漏电流:反向工作电流仅 ~1 μA,有利于低功耗系统长期并联使用而不影响静态电流。
  • 宽温度范围:适用于严苛环境和工业级应用。
  • 符合 IEC 抗干扰标准:通过 ESD、EFT 测试,更易满足系统级电磁兼容设计要求。
  • 小型 SOD-123FL 封装:便于自动化贴装与批量生产,占板面积小。

四、典型应用场景

  • 工业电源输入、直流母线和保护回路(工作电压接近 64 V 的场合)
  • 通信设备的接口保护(如以太网、串口外部供电节点的浪涌钳位)
  • 测控、传感器电源线和信号线的瞬态保护
  • 终端设备与配电模块的过压/雷击浪涌缓冲

五、设计与选型建议

  • 选择原则:Vrwm 应高于最大工作电压但靠近系统正常电压,SMFJ64A 的 64 V 适合最高工作电压接近此值的系统;若系统工作电压更高或需要更低钳位,应选用额定更高或不同规格的 TVS。
  • 能量余量:200 W(10/1000 μs)为器件峰值能力,设计中应考虑浪涌源强度和重复脉冲次数,必要时采用并联或外加限流/滞流元件提升保护能力。
  • 布局注意:TVS 应靠近被保护端口放置,走线最短并使用足够宽的接地回流路径以降低钳位电压与 EMI。
  • 热管理:长时间或频繁大脉冲可能引起封装热应力,设计时应考虑足够的间隔与散热条件。

六、封装与可靠性

SOD-123FL 小尺寸封装适合 SMT 工艺,便于自动化贴装。器件温度范围宽(-55 ~ +150 ℃),适合工业寿命及现场使用。为保证焊接可靠性,请参照制造商的回流焊曲线与存储防潮要求。

七、订购与使用注意

  • 型号:SMFJ64A,品牌:BORN(伯恩半导体)。
  • 在批量采购与设计验证前,建议索取并阅读完整数据手册(主要电气特性、封装尺寸、回流曲线与可靠性试验结果)。
  • 在极端环境或关键应用中,建议进行实际系统级的浪涌/ESD 测试以验证保护效果。

如需我帮你整理该器件的电气等效模型、PCB 布局示意或在特定应用(例如 48 V 通信电源)中的选型比较,我可以进一步提供实用建议与计算示例。

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