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BORN 1SMA4758A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN 1SMA4758A
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- 1SMA4758A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.114g
- Electronic Component
- 1
- (Zzk)
- 2kΩ
- (Zzt)
- 110Ω
- Electronic Component
- BM0264583404
- Diode
- 1
- Current(Ir)
- 5uA
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA4758A 产品概述
一、产品简介
1SMA4758A 是一款由 BORN（伯恩半导体）提供的 1W 功率级贴片稳压二极管，SMA（DO-214AC）封装，适合高电压箝位与基准应用。该器件标称稳压值为 56V，设计用于以并联（分流）方式对局部电源或信号节点进行稳压与过压保护。
二、关键参数与含义
- 二极管配置：1 个独立式稳压管（单个二极管）。
- 稳压值（标称）：56V。
- 反向电流（Ir）：≤5 μA（在规定反向电压或测试条件下）。
- 最大耗散功率（Pd）：1W（在推荐的散热条件下）。
- 阻抗 Zzt：110 Ω（表示在规定测试电流下的动态阻抗，影响调节精度）。
- 阻抗 Zzk：2 kΩ（表示接近击穿电流转折处的等效阻抗，影响低电流时的特性）。
- 工作结温范围：-55℃ 至 +150℃。
- 封装：SMA（DO-214AC），适配常见 SMD 贴片工艺。
三、主要特性与优点
- 小型贴片封装，便于自动贴片与高密度 PCB 设计。
- 56V 标称电压适用于中高压箝位，适合工业与通信等需要较高稳压点的场合。
- 较低的反向漏电流利于低功耗和高阻抗场合使用。
- 两级阻抗特性（Zzt 与 Zzk）能在不同工作点下提供可预测的动态响应，有利于设计稳压精度及噪声分析。
- 宽工作结温范围，适应严格的工业环境。
四、典型应用场景
- 高电压直流母线的并联稳压与局部参考源。
- 电源浪涌或过压保护（与限流元件配合使用）。
- 工业控制、通信基站、测量设备中的电压参考或过压箝位。
- 对 ADC、比较器等输入端的保护与电平钳位。
五、封装与装配建议
- SMA 封装在回流焊工艺下可实现可靠焊接，建议遵循器件制造商的回流温度曲线与 JEDEC 指南。
- 作为 1W 器件，散热依赖 PCB 铜箔面积与过孔热路径：推荐在铜箔扩大焊盘、必要时在底层追加散热层与通孔以提升热传导。
- 在高环境温度下需对耗散功率进行降额处理，具体降额曲线应按器件数据手册或热阻计算确定。
六、选型与可靠性注意事项
- 设计时根据最大允许功耗（Pd=1W）与电流－电压关系计算器件结温，确保在最坏工况下不超过 Tmax（+150℃）。
- 若需要更低噪声或更精确的参考电压，可考虑选用低阻抗、小容差的稳压整流器或专用参考源。
- 储存与装配过程中应采取常规静电防护与湿度控制，避免运动损伤与焊接应力过大。
- 推荐在最终应用中进行温度循环与长期老化试验，验证可靠性与参数漂移。
如需完整电气特性曲线、测试电流条件、热阻值与封装外形尺寸图，请参考 BORN（伯恩半导体）1SMA4758A 的详细数据手册以获得精确设计参数。
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