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BORN MB6F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN MB6F
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- MB6F
- Electronic Component
- 1
- Package
- MBF
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 1.452g
- Electronic Component
- 1
- Electronic Component
- BM0264595464
- Current
- 800mA
- Current(Ir)
- 5uA@600V
- (Vf)
- 1V@500mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB6F 单相整流桥产品概述
一、产品简介
MB6F 为 BORN（伯恩半导体）推出的单相整流桥，采用 MBF 外形封装，面向中低功率交流-直流整流应用。器件在 500mA 工作点处正向压降低至约 1.0V，反向漏电流在 600V 时仅 5μA，适合需要低损耗与高耐压并重的场景。
二、主要电气参数
- 正向压降 (Vf)：1.0V @ 500mA
- 直流反向耐压 (Vr)：600V
- 平均整流电流 (If)：800mA
- 反向电流 (Ir)：5μA @ 600V
- 非重复峰值浪涌电流 (Ifsm)：30A（单次浪涌）
- 工作结温范围：-55℃ ~ +150℃
三、产品特点
- 高耐压设计，适合高电压输入的整流应用；
- 低正向压降，降低整流损耗与发热；
- 低反向漏电流，有利于高阻抗或待机功耗敏感电路；
- 良好的瞬态浪涌承受能力，可应对开机或故障瞬态电流；
- 宽温工作范围，适应工业级环境。
四、典型应用
- 开关电源与功率适配器的桥式整流；
- LED 驱动与照明电源；
- 小型电机驱动与家电控制电路；
- 工业与仪表电源、充电器与备用电源模块。
五、实用建议与注意事项
- 封装热阻有限，800mA 连续整流时需考虑散热与 PCB 散热设计，必要时加铜箔或散热片；
- 峰值浪涌 Ifsm 为单次规格，频繁的大电流冲击会影响寿命，应在电路中限制浪涌电流；
- 在高温或高电压应用中，应按照厂商结温-寿命曲线做降额设计；
- 安装时注意极性标识，避免反向接入造成损坏；
- 在对漏电流敏感的应用场合，推荐进行实测验证以确认待机表现。
六、封装与采购信息
- 封装：MBF（MB6F 系列桥形封装）
- 品牌：BORN（伯恩半导体）
在选型与采购时，请对照完整 datasheet 确认引脚排列、封装尺寸及热阻参数，以便 PCB 布局与机械安装。
如需进一步的电气图、封装尺寸或热特性曲线，可提供具体使用场景，我可协助匹配参考设计与降额建议。
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