WMSIC Electronic Components

BORN RS1D

ModelRS1D
PackageSMA
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN RS1D
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
RS1D
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.123g
Electronic Component
1
Electronic Component
BM0264897302
Current
1A
Current(Ir)
10uA@200V
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000
Voltage Rating(Vr)
200V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS1D 产品概述

一、产品简介

RS1D 系列为 BORN(伯恩半导体)出品的一款通用整流二极管,SMA 塑料封装,面向中低功率整流和保护电路。器件采用模塑塑料外壳,极性由色带标注阴极,适合印刷电路板(SMT)组装与大批量生产。该器件在 1A 直流整流工况下具有较低的正向压降,并能 withstand 高达 200V 的反向电压,适用于多种消费与工业电子场合。

二、电气参数

  • 正向压降 (Vf):1.3V @ If = 1A
  • 直流反向耐压 (Vr):200V
  • 额定整流电流:1A(平均)
  • 反向漏电流 (Ir):10μA @ Vr = 200V
  • 反向恢复时间 (Trr):250ns
  • 工作结温范围:-55℃ ~ +150℃
  • 非重复峰值浪涌电流 (Ifsm):30A(峰值,典型 8.3ms 半波浪涌条件)

三、主要特点

  • 低正向压降,提升整流效率并降低发热;
  • 低漏电流,适合高阻抗或待机功耗要求的电路;
  • 中等反向恢复时间(250ns),在开关频率不太高的电源与保护场合表现良好;
  • 宽温度范围和较高的浪涌能力,增强系统抗瞬态能力与可靠性;
  • SMA 表面贴装封装,便于自动化贴装与焊接。

四、封装与极性

  • 外壳:模塑塑料(SMA 封装,符合表面贴装工艺)
  • 极性标识:色带表示阴极端,安装时注意与电路极性对应
  • 机械尺寸与焊盘图请参照厂方封装图纸以保证良好热散与焊接可靠性。

五、典型应用

  • 开关电源的输出整流与续流保护;
  • 适配器、充电器和家电电源模块;
  • 反向电压保护、电池充放电线路;
  • 灯具驱动、马达驱动的低频续流场合;
  • 通用功率整流与浪涌抑制电路。

六、使用注意事项

  • 反向耐压 200V,应避免长期在或超过该值下工作以防击穿;
  • 反向恢复时间 250ns 表明在高频开关应用中会产生一定反向能量损耗,频率较高的开关电源建议评估恢复损耗或选用快速/超快速二极管;
  • 器件额定平均整流电流为 1A,如需长期稳定工作需考虑良好的PCB散热设计并进行电流/温度降额;
  • 浪涌电流 Ifsm 30A 是允许的瞬态值,非连续重复使用,应按实际浪涌条件评估寿命与可靠性。

七、可靠性与焊接建议

  • 建议按 IPC/J-STD-020 等行业标准的回流焊曲线进行组装,避免超过封装和内部焊料的最大峰值温度;
  • 为降低结温,适当设计铜皮和散热通道,特别是在连续大电流或高环境温度应用中;
  • 出厂前进行来料检测及必要的老化/浪涌测试可提升终端产品可靠性。

RS1D 凭借均衡的电气参数、实用的 SMA 封装与良好的浪涌能力,是多种中低功率整流与保护应用的性价比较高选择。如需更详细的参数曲线、封装图纸或可靠性数据,建议参阅 BORN 官方数据手册或联系供应商获取完整资料。

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