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BORN 1SMA4753A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN 1SMA4753A
- Type
- BORN
- Minimum package
- 5000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- 1SMA4753A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.11g
- Electronic Component
- 1
- (Zzk)
- 1kΩ
- (Zzt)
- 50Ω
- Electronic Component
- BM0231019422
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA4753A 产品概述
一、产品概况
1SMA4753A 为 BORN（伯恩半导体）供应的瞬态电压抑制/稳压型元件，采用 SMA（DO-214AC）封装，适用于直流支路或信号线的过压、浪涌保护。元件设计用于在系统遭受瞬态高电压时钳位并吸收能量，保护下游器件免受损坏。产品工作结温范围宽，适合工业级环境。
二、主要电气参数及其含义
- 稳压值（标称）36V：器件在规定工作条件下的标称钳位/稳压点，表明在浪涌发生时器件在该电压区间内开始导通并钳制过电压。
- 反向电流 Ir = 5 μA @ 27.4V：在27.4V 反向偏置下的漏电流，反映静态泄漏特性及对系统待机功耗的影响。
- 阻抗 Zzk = 1 kΩ：小信号（低频或静态）阻抗，表示在小幅电压变化下器件的阻抗特性。
- 阻抗 Zzt = 50 Ω：瞬态或高频条件下的等效阻抗，关乎器件在快速脉冲条件下的响应与钳制能力。
- 耗散功率 Pd = 1 W：器件在标准条件下可连续耗散的功率上限，实际允许值受散热条件与环境温度影响。
三、封装与机械特性
1SMA4753A 采用 SMA（DO-214AC）封装，体积小、安装方便，适合表面贴装工艺。该封装在PCB上占板面积较小，便于多个保护元件并列应用。设计时需考虑焊盘尺寸与热扩散路径以优化散热。
四、典型应用场景
- 直流电源总线保护（36V 等级系统）
- 通信设备与接口线路的浪涌防护
- 工业控制与汽车电子中的瞬态抑制（在符合温度与功率条件下）
- 继电器、驱动模块及其它对过压敏感电路的保护
五、使用与布局建议
- 将器件尽量靠近需保护点布置，缩短导线/走线长度以降低串联感抗与延迟。
- 保持焊盘良好接地或散热铜箔，以帮助热量扩散并提高持续耗散能力。
- 若系统可能出现高能量冲击，建议在 TVS 前加入限流元件（如熔断器或串联电阻）以分担能量。
- 注意器件极性（若为单向型），正确方向可防止反向损坏；双向型号在替换时亦需核对规格。
六、热与可靠性注意事项
- 工作结温范围 -55℃ ~ +150℃，高温下需按厂商热阻/降额曲线对耗散功率进行降额处理，避免长期在 Pd 极限下工作。
- 反复的大能量冲击会影响寿命与参数漂移，应根据实际浪涌谱选择合适的型号或增加保护级数。
- 存储与回流焊温度应遵循封装可靠性规范，防止焊接应力或热循环导致封装裂纹。
七、选型与采购建议
- 确认系统的工作电压、最大允许泄漏电流与所需钳位电平，确保 36V 标称稳压值与实际应用匹配。
- 若系统存在高能级雷击或工业冲击，评估是否需要更高功率等级或并联多只器件分担能量。
- 采购时核对厂商型号、批号与检测报告，确认封装（SMA/DO-214AC）及电气特性与所需一致。
以上为基于提供参数的 1SMA4753A 产品概述与应用参考，实际设计中请结合完整的器件数据手册与环境条件进行最终评估。
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