Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BORN(伯恩半导体)ABS10 是一款单相整流桥,面向高耐压小功率整流场合。器件典型参数包括:正向压降 Vf = 1.0V(在 If = 400mA 时)、直流反向耐压 Vr = 1000V、整流电流 Io = 1A、反向电流 Ir = 10µA(在 Vr = 1000V 时)、非重复峰值浪涌电流 Ifsm = 30A。工作结温范围宽(-55℃~+150℃),封装以 ABS 塑料封装形式提供,适合常规电源和高压整流应用。
ABS 塑料封装适合通用安装,但平均整流电流 1A 下仍需考虑热量分散。建议在 PCB 设计时提供足够的铜箔面积作为散热路径,并在连续高电流或高环境温度下进行降额使用;对频繁浪涌场合,应评估峰值能量并采取限流或软启动措施。
在量产前建议进行样机验证:包括高压持续耐压测试、反向漏电测试、热循环与温升测试、浪涌与瞬态抗扰度测试。对关键应用(如医疗、计量、高可靠系统)应制定额外的老化和加速寿命试验。
ABS10 以其 1000V 的高耐压、低漏电和通用 ABS 封装,适合高压小功率整流与保护应用。在选择时应综合考虑平均整流电流、热管理能力与浪涌环境:若长期工作电流接近 1A 或存在频繁大浪涌,建议选择更高额定电流或更强散热的封装;若目标是高压低功耗的仪器供电,ABS10 为经济且实用的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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