WMSIC Electronic Components

BORN ABS10

ModelABS10
PackageABS
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN ABS10
Type
BORN
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
ABS10
Electronic Component
1
Package
ABS
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.157g
Electronic Component
1
Electronic Component
BM0264682177
Current
1A
Current(Ir)
10uA@1000V
(Vf)
1V@400mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ABS10 产品概述

一、产品简介

BORN(伯恩半导体)ABS10 是一款单相整流桥,面向高耐压小功率整流场合。器件典型参数包括:正向压降 Vf = 1.0V(在 If = 400mA 时)、直流反向耐压 Vr = 1000V、整流电流 Io = 1A、反向电流 Ir = 10µA(在 Vr = 1000V 时)、非重复峰值浪涌电流 Ifsm = 30A。工作结温范围宽(-55℃~+150℃),封装以 ABS 塑料封装形式提供,适合常规电源和高压整流应用。

二、主要技术参数

  • 正向压降:1.0V @ 400mA(标称)
  • 直流反向耐压:1000V(最大额定)
  • 整流电流:1A(平均)
  • 反向漏电流:10µA @ 1000V
  • 非重复峰值浪涌电流:30A(一次性峰值)
  • 工作结温:-55℃ ~ +150℃
  • 类型:单相整流桥(四二极管桥式结构)
  • 封装:ABS(塑料)

三、关键特性与优势

  • 高耐压:1000V 反向耐压能满足高压整流、仪器、电源保护等场合的需求。
  • 低漏电:在高压条件下反向电流仅 10µA,有利于降低待机功耗和避免高压下的热失控。
  • 合理的正向压降:1.0V(400mA)在小功率整流中具有较好效率与发热平衡。
  • 峰值冲击能力:30A 的非重复峰值浪涌电流能承受短时启动或浪涌冲击,但不适合作为长期冲击承载。

四、典型应用场景

  • 高压整流电源(小功率)
  • 仪器仪表高压电源、测试设备
  • 充电器、适配器中次级或高压侧整流(在额定范围内)
  • 交流到直流转换的保护与整流模块
  • 需要低漏电、高耐压的小型电子产品

五、封装与热管理

ABS 塑料封装适合通用安装,但平均整流电流 1A 下仍需考虑热量分散。建议在 PCB 设计时提供足够的铜箔面积作为散热路径,并在连续高电流或高环境温度下进行降额使用;对频繁浪涌场合,应评估峰值能量并采取限流或软启动措施。

六、使用注意事项

  • 在接线时注意桥式引脚的 +、-、~(两个交流端)极性标识,避免反接导致损坏。
  • Ifsm 为一次性峰值能力,不宜作为长期冲击负载;对重复浪涌应选择更高规格或增加保护电路。
  • 在高压应用中,应验证实际反向漏电对电路的影响,必要时采取分压或屏蔽措施以保证可靠性。
  • 环境温度高时需按温度特性降额使用,避免结温超限。

七、可靠性与验证建议

在量产前建议进行样机验证:包括高压持续耐压测试、反向漏电测试、热循环与温升测试、浪涌与瞬态抗扰度测试。对关键应用(如医疗、计量、高可靠系统)应制定额外的老化和加速寿命试验。

八、结论与选型建议

ABS10 以其 1000V 的高耐压、低漏电和通用 ABS 封装,适合高压小功率整流与保护应用。在选择时应综合考虑平均整流电流、热管理能力与浪涌环境:若长期工作电流接近 1A 或存在频繁大浪涌,建议选择更高额定电流或更强散热的封装;若目标是高压低功耗的仪器供电,ABS10 为经济且实用的选择。

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