WMSIC Electronic Components

BORN SMAJ100A

ModelSMAJ100A
PackageDO-214AC
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMAJ100A
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMAJ100A
Electronic Component
1
Package
DO-214AC
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.18g
Electronic Component
1
Electronic Component
BM0264602954
Voltage
162V
Current(Ir)
1uA
Voltage(VBR)
111V
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMAJ100A 产品概述

一、产品简介

SMAJ100A 是 BORN(伯恩半导体)推出的一款单向防护型瞬态电压抑制(二极管)器件,采用 DO-214AC(SMAJ)封装,专为电信及计算机等对浪涌/瞬态抑制要求较高的系统设计。该器件以玻璃钝化芯片和环氧树脂封装实现优良的可靠性和长期稳定性,适用于直流或单向信号线路的过电压保护。

二、主要参数

  • 极性:单向
  • 反向工作电压 Vrwm:100 V
  • 击穿电压 VBR(典型):111 V
  • 钳位电压(示例):162 V
  • 峰值脉冲电流 Ipp:2.5 A
  • 峰值脉冲功率 Ppp:400 W(按标准脉冲测试条件)
  • 反向泄漏电流 Ir:1 μA(在 Vrwm 条件下的典型小值)
  • 类型:TVS(瞬态抑制二极管)
  • 封装:DO-214AC(SMAJ)

三、关键特性

  • 出色的钳位能力:在瞬态冲击发生时,SMAJ100A 能将过电压限制在安全水平(典型钳位值 162 V),有效保护被连接的器件。
  • 低泄漏电流:典型反向电流仅为 1 μA,有利于保持系统静态能耗低,适合对待机功耗敏感的设备。
  • 低电容:适合高速信号或数据线保护,减少对信号完整性的影响。
  • 高浪涌承受能力:400 W 峰值脉冲功率与 2.5 A 峰值脉冲电流,能应对常见的雷击或开关瞬态冲击。
  • 可靠芯片工艺:采用玻璃钝化工艺提高元件稳定性与长期耐受能力;环氧封装提供良好的机械保护与耐环境能力。

四、典型应用场景

  • 电信设备:线路保护、端口防护、基站设备的输入端防浪涌。
  • 计算机与网络设备:接口保护(如串口、以太网电源线)、主板电源与外围模块防护。
  • 工业控制与电源系统:用于直流供电线路与敏感控制信号的瞬态保护。

五、封装与安装说明

SMAJ100A 使用 DO-214AC(SMAJ)封装,适用于手工焊接与波峰/回流焊工艺。焊盘设计应注意热散与机械应力分布,推荐在 PCB 上为器件提供适当的接地平面以提高浪涌能量分散能力。

六、选型与注意事项

  • 若系统工作电压接近或超过 Vrwm(100 V),应选择更高 Vrwm 额定值的器件或并联保护方案。
  • 钳位电压对受保护器件的耐压能力至关重要,选型时请验证被保护器件能承受典型钳位值 162 V。
  • 峰值功率与脉冲形状/持续时间有关,选型时应参照器件完整数据表中规定的脉冲参数(如 10/1000 μs 或 8/20 μs)。
  • 高温或反复冲击下泄漏电流和击穿特性会有变化,关键应用建议进行实际环境下的可靠性验证。

七、总结

SMAJ100A 以其高钳位能力、低泄漏、低电容与优良的浪涌承受力,成为电信与计算机等领域处理中高电压瞬态保护的理想选择。推荐在设计之初结合系统电压、冲击能量与信号完整性要求,参照完整规格书进行最终选型与布局验证。若需更详细的电气特性曲线和测试条件,请查阅 BORN 官方器件数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.