WMSIC Electronic Components

BORN SMBJ14A

ModelSMBJ14A
PackageDO-214AA(SMB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMBJ14A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMBJ14A
Electronic Component
1
Package
DO-214AA(SMB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.192g
Electronic Component
1
Electronic Component
BM0226248454
Voltage
23.2V
Current(Ir)
1uA
Voltage(VBR)
17.2V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ14A 产品概述

一、产品简介

SMBJ14A 是 BORN(伯恩半导体)出品的一款单向 TVS 晶体管,用于瞬态过压保护,特别适合 12V/14V 工作电源和工业控制线路的浪涌抑制。封装为 DO-214AA(SMB),便于表面贴装与大功率脉冲能量分散。

二、关键参数解读

  • 反向工作电压 Vrwm:14V(适用于标称 12V 电源的导通前端)
  • 击穿电压 Vbr:17.2V(器件开始进入限压区的电压)
  • 钳位电压 Vc:23.2V(在 10/1000µs 浪涌下的典型钳位电压)
  • 峰值脉冲功率 Ppp:600W @ 10/1000µs(单次浪涌能量指标)
  • 峰值脉冲电流 Ipp:25.9A @ 10/1000µs(对应上述 Ppp 与 Vc)
  • 反向泄漏电流 Ir:≈1µA(在 Vrwm 下的漏电表现)
  • 极性:单向(适用于直流电源线,有极性要求)

三、主要特点

  • 高能量吸收能力:600W 峰值脉冲功率可对抗瞬间大能量浪涌。
  • 低漏电:1µA 的低反向电流,适合对静态功耗敏感的系统。
  • 明确的工作窗口:Vrwm=14V 能与 12V 母线系统匹配,击穿与钳位电压提供良好保护裕度。
  • SMB 表贴封装,便于自动化贴装和 PCB 热管理。

四、典型应用场景

  • 汽车电子(车载 12V/14V 子系统的瞬态保护,需注意汽车特有的脉冲规范)。
  • 工业设备电源总线、继电器线圈、马达驱动输入端的浪涌抑制。
  • 电池管理与充电线路、通信接口的过压保护(注意单向器件不适合需双向保护的 AC 信号)。

五、选型与使用建议

  • 确认被保护点正常工作电压小于 Vrwm(本件为 14V),否则会产生持续漏电或误触发。
  • 钳位电压 23.2V 为瞬态下的典型峰值,设计时应确保后级元件能承受该电压或额外采取限压措施。
  • Ppp 为单次脉冲能量指标,若存在重复脉冲或高频脉冲场景,应按制造商的重复脉冲曲线做降额或选择更高功率器件。
  • 单向器件应按极性正确焊接:器件的阴极端接被保护线,阳极端接地(或系统参考)。

六、封装与可靠性注意事项

  • DO-214AA(SMB)封装利于热扩散,但热阻仍依 PCB 币迹面积与散热层影响;对高能量脉冲需增大铜箔面积以利散热。
  • 焊接和回流工艺请遵循制造商建议的温度曲线,避免过热损伤器件封装或内芯片。

七、验证与测试建议

  • 在目标系统上进行 10/1000µs 浪涌测试,验证钳位电压、热稳定性与后级设备耐受性。
  • 做泄漏电流、击穿电压与重复脉冲耐受性测试,确认在实际工作温度和 PCB 布局下的表现满足要求。

总结:SMBJ14A 为面向 12V/14V 电源与工业线路的高能量单向 TVS 器件,具有 600W 单次吸收能力、低漏电和 SMB 便捷封装,适合保护电源总线与敏感电子模块,但在重复脉冲和热管理场景需按规范降额与优化 PCB 布局。若需更详细的温度特性或重复脉冲曲线,请参考 BORN 官方数据手册。

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