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BORN SMD0805-050/06N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD0805-050 / 06N
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD0805-050/06N
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.031g
- Electronic Component
- 2.2mm
- Electronic Component
- 0.8mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264577790
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD0805-050/06N 产品概述
一、概述
SMD0805-050/06N 为 BORN（伯恩半导体）系列 0805 封装自恢复保险（PPTC）器件，针对低电压、便携与接口保护设计。器件尺寸 2.2mm × 1.5mm × 0.8mm，适配标准 0805 焊盘，提供快速响应的过流保护并能在故障解除后自动恢复，适用于空间受限的表贴电路。
二、主要电气参数
- 最高耐压（Vmax）：6 V
- 瞬态承受电流（Imax）：30 A（短时浪涌能力）
- 保持电流（Ihold）：500 mA（温升不超过规定值时稳定工作）
- 跳闸电流（Itrip）：1 A（典型触发点）
- 功耗/最大耗散（Pd）：500 mW
- 初始态阻值（Rmin）：100 mΩ
- 跳断后阻值（R1max）：850 mΩ（触发后高阻态）
- 动作时间：100 ms（由过流到跳闸的典型时间）
- 工作温度：-40 ℃ ~ +85 ℃
三、主要特性与优势
- 小体积 0805 封装，便于高密度 PCB 布局与自动贴装；
- 低初始阻值（≈100 mΩ），对正常供电影响小；
- 快速触发（≈100 ms）对短路和持续过流具有良好保护能力；
- 自恢复特性：当故障消除后，器件阻值恢复至低阻状态，便于重复使用；
- 短时承受大浪涌（30 A）保障设备在启动或突发冲击时的鲁棒性。
四、典型应用场景
- USB/充电接口过流保护；
- 电池管理与便携设备电源保护；
- 消费电子、视频接口（如 HDMI 子模块）输入防护；
- 通信、物联网节点与传感器前端保护；
- 小功率 DC 轨道的短路与过载保护。
五、封装与安装注意事项
- 推荐采用标准 0805 焊盘尺寸并遵循厂家提供的回流焊温度曲线；高温峰值需参阅原厂资料以避免性能退化；
- 焊接时避免长时间超温和重复加热；
- 布局时尽量靠近需要保护的输入口并保持良好散热路径；
- 不建议将多个器件并联使用以提高电流能力，PPTC 并联不保证均流性，必要时选用额定更高型号或传统熔断器。
六、选型与可靠性提示
- 选择时确保工作电流长期低于 Ihold，并考虑环境温度、散热与周边元件对实际 Ihold 的影响（高温会降低保持电流）；
- 由于最高耐压仅 6 V，适用于 5 V 或更低电压系统；高电压场合需选用更高耐压器件；
- 对于关键安全应用或频繁大电流冲击场景，建议参照 BORN 的完整数据手册与可靠性测试报告进行验证。
如需完整规格书、回流焊曲线或推荐焊盘尺寸，可联系 BORN（伯恩半导体）或提供更详细的应用场景以获得针对性建议。
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