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BORN M1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN M1
- Type
- BORN
- Minimum package
- 5000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- M1
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.543g
- Electronic Component
- 1
- Electronic Component
- BM0258759997
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@50V
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M1 产品概述
一、产品简介
M1 为 BORN（伯恩半导体）推出的通用整流二极管，采用独立式封装（SMA / DO-214AC）。该器件面向常规电源、保护与整流应用，具有稳定的正向压降和良好的浪涌承受能力，适合中低压直流电路的整流与保护使用。
二、主要规格
- 正向压降 (Vf)：1.1V @ 1A
- 额定整流电流：1A（直流）
- 反向耐压 (Vr)：50V
- 反向电流 (Ir)：最大 5μA @ 50V
- 非重复峰值浪涌电流 (Ifsm)：30A
- 工作结温：-55℃ ~ +125℃
- 封装：SMA (DO-214AC) 独立式
三、器件特性亮点
- 低正向压降：1.1V @1A 在整流效率和功耗控制上表现良好，适合对压降敏感的电源回路。
- 低漏电：5μA @50V 的漏电特性，有利于待机功耗控制与高阻抗节点的保持。
- 强浪涌抑制：30A 的峰值浪涌承受能力，能应对开机冲击和瞬态脉冲，提升电路鲁棒性。
- 宽温区工作：-55℃~+125℃ 满足工业级环境要求，可靠性高。
四、典型应用场景
- 开关电源输出整流、反向保护
- 电池充放电路径和续航保护电路
- DC-DC 转换器的整流与钳位
- 通讯设备、家用电器和工业控制中一般整流与保护用途
五、封装与热管理
SMA/DO-214AC 为表面贴装独立式封装，具有良好的散热路径与机械强度。虽然器件能承受较高浪涌，但在长期1A连续工作时仍建议评估PCB铜箔面积与散热设计：
- 在器件引脚周围留足铜箔，建议在顶层/底层增加散热铺铜并连接热vias（若双面板或多层板可通过过孔导热）。
- 在高环境温度或紧凑布局时，降低工作电流或改用更大功率器件以保证结温在安全范围内。
六、使用与焊接注意事项
- 推荐的回流焊温度应符合封装厂商的规范，避免长时间超过最高结温。
- 防止静电与机械应力，储存与贴装按 IC 类元件常规防护处理。
- 对于重复峰值浪涌或持续高脉冲环境，应做浪涌能量评估，必要时并联或采用更高规格的器件。
七、可靠性提示
长期工作在高温或频繁经历大电流冲击会影响寿命。建议在设计阶段留有裕量（电流与功耗上至少 20% 余量），并做热仿真与实际温升测量，确保器件结温在规定范围内运行。
总结：M1（BORN）是一款适用于通用整流与保护场合的 50V/1A SMA 二极管，特点为低正向压降、低漏电与较强的浪涌承受力，适合工业与消费电子中对可靠性和成本均有要求的整流方案。
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