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BORN US2G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN US2G
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- US2G
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.123g
- Electronic Component
- 1
- Electronic Component
- BM0264900543
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.7V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US2G 产品概述 — BORN（伯恩半导体）
一、产品简介
US2G 是一款由 BORN（伯恩半导体）提供的独立式整流二极管，采用 SMA 塑料封装，极性由色带标示阴极。该器件为快速恢复整流二极管，设计用于中高压直流整流与开关电源回路，兼顾较高浪涌能力与较小反向漏电，适合工业级应用场景。
二、主要电气参数
- 正向压降（Vf）：1.7V @ 1A
- 直流反向耐压（Vr）：400V
- 平均整流电流（IF）：2A
- 非重复峰值浪涌电流（Ifsm）：50A（一次浪涌）
- 反向电流（Ir）：5μA（常温条件下）
- 反向恢复时间（Trr）：100ns
- 工作结温范围：-55℃ ~ +150℃
三、产品特性与优势
- 高频开关兼容：100ns 的反向恢复时间使其适用于中等开关频率的开关电源与电机驱动回路，能有效降低开关损耗与电磁干扰。
- 高压耐受：400V 的反向耐压覆盖常见离线电源与中压整流场景。
- 良好浪涌能力：50A 的峰值浪涌能力应付启动冲击与短时过载环境。
- 低漏电流：5μA 的反向漏电利于低静态功耗设计，适用于需保持待机能耗低的设备。
四、封装与识别
- 封装类型：SMA 模制塑料封装，体积小、散热路径以 PCB 铜箔为主。
- 极性识别：端面色带表示阴极，便于装配与自动化贴片识别。
- 机械可靠性：适合常规回流焊与波峰焊流程，但应遵循制造商的焊接曲线与温度限制以防封装与内部焊点应力损伤。
五、典型应用场景
- 开关电源（SMPS）主/次侧整流与续流二极管
- 适配器、充电器的整流与保护电路
- 电机驱动的自由轮整流、反向抑制与钳位电路
- 工业电源、照明驱动与家电控制板的中压整流需求
六、使用与可靠性建议
- 散热与布板：SMA 外壳散热依赖 PCB 热阻，建议在焊盘附近增加铜面积并做热过孔以提高导热，必要时配合散热片或局部散热设计。
- 浪涌与保护：尽量避免频繁超过 Ifsm 的冲击，必要时在输入端加入限流或压敏元件（TVS）以保护二极管。
- 开关频率与损耗：1.7V 的正向压降在 1A 条件下会带来较高导通损耗，设计时应考虑热升与效率权衡；若需更低 Vf，可选取肖特基或低 Vf 快恢复器件。
- 储存和装配：建议按通用电子元件储存规范防潮防尘，并在装配时注意静电防护（ESD）。
总结：US2G 在中高压整流、开关电源与工业控制领域提供了平衡的电压耐受、快速恢复性能与良好浪涌能力，是对可靠性与成本敏感场合的合适选择。若需进一步的封装尺寸图、温度特性曲线或生命周期可靠性数据，可联系 BORN（伯恩半导体）获取完整数据手册。
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