WMSIC Electronic Components

BORN BEP3100TA

ModelBEP3100TA
PackageSMA(DO-214AC)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BEP3100TA
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BEP3100TA
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Thyristor Surge Suppressor (TSS)
Electronic Component
0.109g
Current
5uA
Electronic Component
1
Electronic Component
BM0264682161
Operating Temperature
40℃~+150℃
Latching Current(Ih)
120mA
Switch Voltage(Vs)
350V
Capacitor(Co)
33pF
Voltage(Vt)
4V
Current(It)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BEP3100TA 产品概述

一、产品简介

BEP3100TA 是 BORN(伯恩半导体)推出的一款 DO-214AC/SMA 封装的半导体放电管(瞬态抑制器/防雷管),面向对电源线和信号线的浪涌、雷击脉冲保护场景。器件体积小、耐压高、响应快,适合插板式或贴片混合组装的防雷与浪涌抑制解决方案。厂商标称防雷等级 2KV,可在工业与民用电源、通信与控制终端中提供过电压保护。

二、主要参数

  • 断态峰值电压 (Vdrm):275 V
  • 漏电流:5 μA(常温、断态条件下)
  • 开关电压 (Vs):350 V
  • 保持电流 (Ih):120 mA
  • 通态电压 (Vt):4 V
  • 通态电流 (It):2.2 A
  • 峰值脉冲电流 (Ipp):45 A(脉冲容限,典型 8/20 μs 类似测量条件)
  • 断态电容 (Co):33 pF
  • 工作温度范围:-40 ℃ ~ +150 ℃
  • 封装:SMA (DO-214AC)
  • 品牌:BORN(伯恩半导体)
  • 防雷等级:2 KV

(以上参数以厂商规格为准,实际应用前建议参考完整数据手册并进行验证测试。)

三、关键特性与优势

  • 高耐压与快速响应:275 V 的断态耐压和低漏流保证在正常工作下稳定;开关动作迅速,可在瞬态过压时快速钳位。
  • 中等能量吸收能力:45 A 峰值脉冲电流适合常见的工业/民用浪涌脉冲(如 8/20 μs 标准)。
  • 低电容:33 pF 的断态电容使其对高速信号线影响较小,适用于部分数据/通信线路防护。
  • 宽温度工作范围:-40 ℃ 至 +150 ℃,满足多数工业环境对温度耐受性的要求。
  • SMA 封装:便于手工焊接或自动贴装,适合替换与设计整合。

四、典型应用场景

  • 交流/直流电源输入端的浪涌保护(如适配器、电源模块)
  • 建筑配电、照明与安防设备的雷击与浪涌防护
  • 工业控制器、PLC、变频器等设备的输入/输出端防护
  • 通信设备、网关、路由器等对瞬态过电压敏感的设备保护(需注意信号完整性)
  • 智能仪表与计量设备的输入端防雷

五、选型与安装建议

  • 根据系统最高工作电压和最大允许泄漏选择合适的断态电压与漏电流。若用于 230 VAC 环境,275 V 级别为常见选择。
  • 验证 Ipp 对应的脉冲波形(如 8/20 μs)与系统可能遭遇的浪涌能量匹配,必要时并联或与气体放电管、熔断器协同保护以提高能量处理能力。
  • 考虑板级布局:将防护器件尽量靠近入线上并提供可靠的回流路径到地;保持与敏感芯片的距离以减小剩余耦合。
  • 对高速信号线应用,注意器件电容对信号带宽的影响;必要时选择更低电容规格或采取差分保护策略。
  • 焊接工艺按照 SMA 封装的回流曲线进行,避免过热影响器件可靠性。

六、可靠性与安全注意

  • 推荐在最终产品中进行实际浪涌测试(例如 IEC 61000-4-5 对应试验)验证整机保护效果。
  • 长期在高温或高频繁浪涌条件下使用时应考虑热耗散与器件寿命衰减,设计冗余或更高能量等级的器件。
  • 产品应与熔断器、气体放电管等元件配合,形成多级防护,提高系统可靠性与安全性。

七、总结

BEP3100TA 以其 275 V 等级的断态电压、45 A 峰值脉冲能力以及 SMA 小巧封装,在中低能量浪涌防护场景中具备良好的性价比。选型时需综合考虑工作电压、浪涌波形、电容影响及系统布局,配合合适的配套保护器件和测试验证,方能得到可靠的防护效果。若需更详细的电气特性曲线和测试条件,请参考 BORN 官方数据手册或向供应商索取样片进行评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.