WMSIC Electronic Components

BORN 1SS355

Model1SS355
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1SS355
Type
BORN
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1SS355
Electronic Component
1
Package
SOD-323
Electronic Component
Switch Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0258885495
Current
100mA
Diode
Electronic Component
Current(Ir)
100nA@80V
(Vf)
1.2V@100mA
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS355 产品概述

一、基本参数

1SS355 为 BORN(伯恩半导体)出品的独立式开关二极管,采用 SOD-323 小型贴片封装。典型电气参数如下:

  • 正向压降 Vf = 1.2V(IF = 100mA)
  • 直流反向耐压 Vr = 90V
  • 正向整流电流 Io = 100mA
  • 功耗 Pd = 250mW
  • 反向漏电流 Ir = 100nA(VR = 80V)
  • 反向恢复时间 Trr = 4ns
  • 非重复峰值浪涌电流 Ifsm = 225mA

二、主要特性

  • 高耐压与低漏电:90V 的反向耐压配合 100nA 级别的漏电,适合高压信号开关与保护用途。
  • 快速开关:4ns 的反向恢复时间使其在高速开关与脉冲应用中响应迅速,降低反向恢复相关损耗。
  • 小封装、低功耗:SOD-323 小体积适合空间受限的表贴设计,250mW 的耗散能力适用于低功率场合。
  • 良好浪涌承受能力:225mA 的峰值浪涌能力可应对短时突发脉冲。

三、典型应用场景

  • 高速信号整流与开关:如通信设备的射频前端保护、开关阵列中的小信号整流。
  • 保护电路:反向电压限制、浪涌抑制和输入端保护。
  • 便携式电子与消费类产品:体积小、适合高密度 PCB 布局的电路保护与信号切换。
  • 波形整形与钳位电路:利用快速恢复特性实现准确的脉冲整形。

四、封装与热管理

SOD-323 为小型表贴封装,适合自动贴装与回流焊工艺。由于 Pd=250mW,设计时需注意:

  • 在高环境温度或连续工作下进行功耗热降额(derating);推荐在 PCB 上增加足够的铜箔散热路径以降低结温。
  • 避免在高功率密度区域集中放置多个发热元件,必要时选用更大功率器件或并联方案。

五、使用建议与注意事项

  • 确认工作电流与平均功耗不超过额定值,短时浪涌不超过 Ifsm。
  • 在高压应用中,留意爬电距离与焊盘间隙,确保满足可靠性要求。
  • 回流焊温度曲线遵循厂方推荐,以避免封装和焊接应力导致可靠性下降。
  • 对于极低漏电或极高速要求的场合,建议在评估样片上测试实际电路环境下的表现。

六、替代型号与采购

1SS355 可与同类参数的快速开关二极管互相参考替代,选择时以 Vr、Vf、Trr 与功耗为优先比较指标。订购时请标注 BORN(伯恩半导体)品牌、型号 1SS355 及 SOD-323 封装,以确保收到符合规格的元件。

如需样片测试建议提供电路工作点(电压、平均/峰值电流、环境温度)以便进一步给出更精准的热与可靠性评估。

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