WMSIC Electronic Components

BORN ES3G

ModelES3G
PackageSMB
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN ES3G
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
ES3G
Electronic Component
1
Package
SMB
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.21g
Electronic Component
1
Electronic Component
BM0264595487
Current
3A
Current(Ir)
5.9uA
(Vf)
1.7V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
400V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES3G 产品概述

一、产品简介

ES3G 是 BORN(伯恩半导体)推出的一款高可靠性整流二极管,采用 SMB 模塑塑料封装,面向工业级开关电源、适配器、逆变器及各类功率整流与续流场合。器件结合较低的正向压降与快速恢复特性,适合在中高压及中等电流工作点下提高系统效率与可靠性。

二、主要电气参数

  • 正向压降 (Vf):1.7 V @ 3 A
  • 直流反向耐压 (Vr):400 V
  • 额定整流电流:3 A
  • 反向电流 (Ir):5.9 μA
  • 反向恢复时间 (Trr):35 ns
  • 工作结温范围:-55 ℃ ~ +150 ℃

这些参数表明 ES3G 在 400V 级别的整流与快速开关场合有良好表现,35 ns 的恢复时间可有效降低开关损耗及电磁干扰风险。

三、结构与封装

  • 封装形式:SMB(表面贴装/通孔兼容的中功率封装)
  • 极性标识:色带表示阴极,便于装配辨识
  • 环氧树脂:符合 UL 94V-0 的阻燃等级,提升安全性
  • 引脚处理:纯锡电镀,符合无铅要求

SMB 封装兼顾散热与焊接可靠性,适合自动化贴装与波峰/回流焊工艺。

四、性能与优势

  • 低正向压降(1.7 V @3 A):在中等电流下降低导通损耗,提高转换效率。
  • 低漏电流(5.9 μA):在高压反向时减少静态损耗与温升。
  • 快速恢复(Trr = 35 ns):减少开关瞬态能量损耗与电磁干扰,适合开关电源与变换器中的续流与整流用途。
  • 宽工作温度(-55 ℃ ~ +150 ℃):满足严苛工业与汽车类环境温度要求。
  • UL 94V-0 阻燃等级与无铅电镀:提升安全与环保合规性。

五、典型应用场景

  • 开关电源(SMPS)整流与续流
  • 适配器、充电器输出整流
  • 逆变器与电机驱动电路的自由轮回路
  • 功率因数校正(PFC)以及功率模块中的中高压整流
  • 其它需要 400 V 级绝缘与快速回复的整流场合

六、焊接与可靠性建议

  • 保证高温焊接能力:器件可承受 260 ℃ / 10 s 的高温焊接工艺,兼容主流回流焊与波峰焊流程。
  • PCB 布局建议:为提升散热,可在焊盘处增加铜面积并使用通孔或散热槽;靠近热源时留足热隔离。
  • 储存与使用:避免潮湿环境长期暴露,遵循元件防潮规范以保障焊接质量与可靠性。

七、品牌与采购

ES3G 由 BORN(伯恩半导体)生产,适合对稳定性与长期供应有要求的项目。选型时请参考厂商完整数据手册,确认具体的温升、峰值脉冲能力及包装形式以满足系统设计需求。

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