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BORN BM3134KE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BM3134KE
- Type
- BORN
- Minimum package
- 8000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BM3134KE
- Electronic Component
- 1
- Package
- SOT-723
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0231019418
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 120pF
- Output Capacitor(Coss)
- 20pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BM3134KE 产品概述
一、器件简介
BM3134KE 是 BORN（伯恩半导体）出品的一款小封装 N 沟道场效应管（MOSFET），适用于低压小电流开关场合。器件额定漏—源电压 Vdss 为 20V，标称连续漏极电流可达 750mA，封装为超小型 SOT-723，适合空间受限的便携与消费类电子设计。
二、主要电气参数
- 类型：N 沟道 MOSFET（增强型）
- 漏—源电压（Vdss）：20V
- 连续漏极电流（Id）：750mA（器件极限值，受封装散热限制）
- 导通电阻（RDS(on)）：约 800mΩ @ Vgs=1.8V, Id=0.45A；约 270mΩ @ Vgs=4.5V, Id=650mA
- 阈值电压（Vgs(th)）：1.1V @ ID=250µA
- 功耗（Pd）：350mW（封装和环境依赖）
- 电容：Ciss ≈ 120pF，Crss ≈ 15pF，Coss ≈ 20pF
三、特点与优势
- 逻辑电平驱动：阈值约 1.1V，1.8V 驱动即可导通，但要达到低 RDS(on) 建议 4.5V 驱动。
- 低电阻版本：在 4.5V 门压下 RDS(on) 可降至约 270mΩ，适合对导通损耗有要求的中小电流负载。
- 封装优势：SOT-723 极小尺寸，适用于空间受限的移动设备与便携外设。
- 开关性能中等：Ciss ~120pF 在低频或中速开关场合可获得较低驱动功耗与良好响应。
四、典型应用场景
- 电池供电的开关控制（低功耗模式切换、软启动）
- 消费类电子小电流负载开关（指示灯、传感器供电）
- 移动设备电源路径控制、负载断开切换
- 电平移位与低压PWM驱动（注意频率与开关损耗）
五、设计与布局建议
- 热管理：SOT-723 封装散热能力有限，350mW 为在特定温度下的额定耗散，实际连续电流应按 PCB 铜箔面积与环境温升评估并留裕量。建议在器件引脚附近使用较大铜箔或散热过孔以分散热量。
- 驱动电压选择：若需最低导通损耗，应采用接近 4.5V 的门极驱动。仅靠 1.8V 驱动可工作但 RDS(on) 较高，适合低电流场合。
- 布线注意：尽量缩短漏极与源极走线，减小寄生阻抗与电压降；门极走线加上适当的阻尼可抑制开关振铃。
- 保护措施：在感性负载或有反向电压情形时，考虑额外的肖特基或二极管保护以缓解体二极管承受的反向能量。
六、选型与注意事项
- 封装与功耗限制是关键考量：若设计中常态电流接近数百毫安并且环境温度较高，应优先评估热仿真或选用更大封装版本。
- 样片验证：在最终应用前进行开关损耗、热升与长期可靠性测试，验证在目标 PCB 布局和工作循环下的实际表现。
综上，BM3134KE 适合用于低压、空间受限场合的中低电流开关应用，凭借逻辑电平特性与小体积封装在便携式与消费电子中具有良好的适配性；但在高连续功率场景下需对热管理与安全余量进行认真规划。
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