WMSIC Electronic Components

BORN B0520WS

ModelB0520WS
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN B0520WS
Type
BORN
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
B0520WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0228551991
Current
500mA
Diode
Electronic Component
Current(Ir)
250uA@20V
(Vf)
390mV@500mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0520WS 产品概述

一、产品简介

B0520WS 是伯恩半导体(BORN)推出的一款独立式肖特基二极管,封装为小型 SOD-323,专为电源整流、反向保护与高频开关应用设计。其典型正向压降低、开关速度快,适合空间受限且对效率有要求的便携与消费类电子产品。

二、主要参数

  • 二极管类型:肖特基 (Schottky)
  • 正向压降 (Vf):390 mV @ 500 mA
  • 直流反向耐压 (Vr):20 V
  • 最大整流电流:500 mA
  • 反向漏电流 (Ir):250 μA @ 20 V
  • 封装:SOD-323
  • 品牌:BORN(伯恩半导体) (以上参数以标称条件为准,具体请参见厂商数据手册)

三、性能特点

  • 低正向压降:Vf≈0.39 V(在 500 mA 条件下),可显著降低整流损耗,提升系统效率。
  • 小体积封装:SOD-323 适合高密度 PCB 布局,便于移动设备、模块化电源应用。
  • 适中耐压与电流能力:20 V 的反向耐压与 500 mA 的整流电流覆盖多数低压电源与信号保护场合。
  • 漏电控制:在 20 V 时反向漏电约 250 μA,需在高温或高阻抗电路中注意漏电影响。

示例功耗估算: 在最大整流电流 500 mA 时的正向功耗 Pd ≈ Vf × If = 0.39 V × 0.5 A = 0.195 W。设计时应考虑封装散热能力与环境温度的影响并适当降额。

四、典型应用场景

  • 手机、蓝牙设备等便携电子的电源整流与反向保护
  • 低压降稳压与降压转换器输出整流
  • USB、充电器电路中用于保护与快速整流
  • 高频脉冲或开关场合的整流与钳位
  • 信号线路的反向保护与浪涌限流(在额定条件下)

五、设计与焊接建议

  • 布局:SOD-323 为小封装,建议在焊盘周围保留适当铜皮以增强散热,若功耗接近算出值,应增加底层铜箔或过孔改善散热。
  • 回流焊:遵循厂商回流温度曲线进行焊接。若无具体曲线,采用标准无铅回流工艺并避免超过 PCB 与封装的热承受极限。
  • 温度影响:肖特基二极管的反向漏电随温度上升而增加,若电路对漏电敏感,应在高温工况下验证并考虑选型降额或加热管理。
  • 并联使用:若需提高电流能力,优先采用电流匹配的对称并联并加串阻或并联降额方案以避免热跑。

六、选型与注意事项

  • 若系统电压接近或超过 20 V,应选择更高 Vr 的器件;若要求更低漏电或更高电流,应考虑其他型号或更大封装的肖特基。
  • 在高温环境或高阻抗负载(例如电池检测)中,应验证 250 μA 的反向漏电是否满足系统要求。
  • 最终设计前,请查阅 BORN 的完整数据手册以获取温度特性曲线、封装尺寸图与回流焊建议,必要时向供应商索取样品进行实测验证。

总结:B0520WS 以其低 Vf、紧凑 SOD-323 封装和适中的电气规格,适合一般低压整流与反向保护应用。合理的电热设计与验证能充分发挥其在功耗与体积上的优势。

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