WMSIC Electronic Components

BORN SMD0603-050/06N

ModelSMD0603-050/06N
Package0603
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD0603-050 / 06N
Type
BORN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD0603-050/06N
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.043g
Electronic Component
1.85mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0257678982
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD0603-050/06N 产品概述

一、产品简介

SMD0603-050/06N 是 BORN(伯恩半导体)出品的一款 0603 封装自恢复熔断器(Polymeric PTC/自恢复保险丝),专为低电压、小体积电路的过流保护设计。器件额定耐压 6V,保持电流 500mA,跳闸电流 1A,具备快速响应和可自恢复的保护特性,适合移动设备、便携类和微功率系统使用。

二、主要电气参数

  • 耐压(Vmax):6V
  • 最大电流(Imax):35A(瞬态耐受/浪涌能力)
  • 保持电流(Ihold):500mA(常温下持续不动作电流)
  • 跳闸电流(Itrip):1A(典型触发电流)
  • 动作时间:100ms(在指定过流条件下的典型动作时间)
  • 初始态阻值(Rmin):100mΩ
  • 跳断后阻值(R1max):800mΩ
  • 消耗功率(Pd):500mW(稳态功耗能力)
  • 工作温度范围:-40℃ ~ +85℃

三、尺寸与封装

  • 封装:0603(毫米级超小封装)
  • 尺寸:长 1.85mm × 宽 1.05mm × 高 1.15mm
    适用于空间受限的表面贴装电路(SMT),支持自动贴装与回流焊工艺。

四、性能特点

  • 小体积、重量轻,便于高密度装板设计。
  • 自恢复功能:在过流消失后可自动恢复,减少维护与更换成本。
  • 快速动作:在过流事件发生时能够在约 100ms 内响应,保护下游元件。
  • 低初始阻抗与较低跳断后残余阻抗,减小正常工作时的压降和待恢复时的发热。
  • 良好的瞬态耐受能力(高达 35A 的瞬态浪涌),适合有启动电流或浪涌条件的应用场景。

五、典型应用

  • 智能手机与可穿戴设备的电源及充电保护
  • 移动电源与便携式电池管理系统(短路/过流保护)
  • USB、OTG 接口保护与数据端口保护
  • IoT 设备、蓝牙模块、电机驱动的小电流保护场景
  • 工业控制板、汽车电子的局部过流保护(遵守温度与电压限制)

六、使用注意事项

  • 最大工作电压仅 6V,严禁在超过额定电压的环境中长期使用。
  • 长时间接近 Ihold 值或在高环境温度下,器件的实际保持电流会降低,建议作适当裕量选择(一般取 1.2~2 倍裕量)。
  • Pd 为 500mW,长期功耗接近该值会引起升温,应在PCB布局上留有散热空间,避免与热敏元件并列密集布置。
  • 回流焊工艺建议采用标准无铅回流曲线,避免长时间高温暴露,防止性能退化。清洗时注意使用对 PTC 材料无腐蚀的溶剂和工艺。

七、可靠性与包装

SMD0603-050/06N 经过温度循环与寿命筛选,适用于-40℃ 至 +85℃ 的工作环境。常见出厂包装为卷盘(Tape & Reel),支持 SMT 自动贴装,量大可按客户要求提供包装与筛选服务。

八、选型建议

  • 若工作电流接近 400–500mA,应选择保持电流略高于实际最大工作电流的型号或增加裕量。
  • 若电路存在频繁短路/浪涌事件,关注器件的重复恢复能力与长期热稳定性,必要时考虑并联或选用更高规格产品。
  • 对于特殊认证与更高电压/功率要求,建议联系供应商获取对应型号与测试资料。

如需样品、详细时间-电流特性曲线或回流焊规范,建议联系 BORN(伯恩半导体)授权经销或技术支持获取完整数据手册与应用建议。

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