WMSIC Electronic Components

BORN 1SMA4740A

Model1SMA4740A
PackageSMA(DO-214AC)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1SMA4740A
Type
BORN
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1SMA4740A
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.11g
Electronic Component
1
(Zzk)
700Ω
(Zzt)
7Ω
Electronic Component
BM0231019395
Diode
1
Power Dissipation(Pd)
1W
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4740A 产品概述

一、概述

1SMA4740A 是由 BORN(伯恩半导体)提供的稳压/钳位器件,封装为 SMA(DO-214AC)。该器件以 10V 的标称稳压值为基准,适用于对电路进行稳压、过压钳位与瞬态抑制等保护功能,尤其适合工业与通信类电子设备中对稳压精度和抗干扰要求较高的场景。

二、主要电气参数

  • 标称稳压值(Vz):10 V
  • 工作结温范围(Tj):-55 ℃ ~ +150 ℃
  • 反向电流(Ir):10 μA @ 7.6 V(代表器件在接近稳压点时的漏电特性)
  • 耗散功率(Pd):1 W(在规定散热条件下的最大耗散能力)
  • 阻抗:Zzk = 700 Ω;Zzt = 7 Ω(分别反映在低电流与钳位/浪涌条件下的阻抗性能)

三、特性与优势

  • 宽工作温度范围(-55 ℃ 到 +150 ℃),可在高低温环境下可靠工作;
  • 低反向漏流(10 μA @ 7.6 V),便于在对静态功耗敏感的电路中使用;
  • 在浪涌或钳位状态下阻抗(Zzt)显著低于静态阻抗(Zzk),意味着器件在吸收突发能量时能更有效钳位电压峰值;
  • SMA 封装体积小,便于表面贴装工艺(SMT),适合中小功率线路板布局。

四、典型应用

  • 电源轨稳压与基准钳位;
  • 输入/输出接口的过压与瞬态抑制保护;
  • 通信设备、仪器仪表、工业控制模块中的局部过压保护;
  • 需要在有限空间内实现中等功率防护的电子模块。

五、封装与热管理

  • 封装:SMA(DO-214AC),适用于常规 SMT 工艺;
  • 熔接与散热:Pd 标称为 1 W,实际应用中应参考 PCB 布局、铜箔面积及环境温度进行热沉设计并按厂方曲线做功率降额;高温下长期工作需做好散热与热循环应力管理。

六、选型与使用注意事项

  • 确认工作电压与稳压值匹配,若工作点接近或超过 7.6 V,应关注 Ir 泄漏对系统的影响;
  • 对瞬态能量吸收能力有更高要求时,需确认器件在规定脉冲条件下的峰值电流与能量等级;
  • PCB 布局建议将器件与被保护元件尽量靠近,增大散热铜箔,避免在超出 Pd 的条件下持续吸收能量;
  • 参考原厂完整数据表(包括温度特性、能量脉冲曲线与封装尺寸)以获得精确设计参数。

总结:1SMA4740A 为一种适用于中等功率稳压与保护场合的器件,结合其 10V 标称稳压、宽温度范围与 SMA 封装,适合工业与通信等多种应用,但在实际设计中应充分考虑热管理与脉冲能量能力,按完整数据表进行选型与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.